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Loudspeaker

A speaker and heat pipe technology, applied in the field of speakers, can solve the problems of speaker damage, speaker volume and heat dissipation space compression, and speaker easy to generate high temperature, etc.

Inactive Publication Date: 2020-12-18
ASUSTEK COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the trend of multimedia electronic devices becoming thinner and smaller, the volume and heat dissipation space of the speakers are gradually compressed, so that the speakers are prone to high temperature under continuous operation, which in turn causes the speaker to be damaged due to high temperature.

Method used

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Examples

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Embodiment Construction

[0017] A number of implementations of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. The description of the structural operation is not intended to limit the sequence of its execution, and any device with equivalent functions produced by recombining the components is within the scope of the present invention. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings. The drawings are for illustration purposes only and are not drawn to scale.

[0018] Please refer to figure 1 . figure 1 Shown is a cross-sectional view of a speaker 1...

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Abstract

The invention discloses a loudspeaker. The loudspeaker comprises a sound box, a loudspeaker single body and a heat conduction pipe, the sound box has a first opening and a second opening. The loudspeaker unit is hermetically connected with the first opening. The heat conduction pipe is hermetically connected with the second opening. The heat conduction pipe has a first end and a second end. The first end is in sound box. The second end is exposed at the second opening. The loudspeaker unit is fixedly connected to at least part of the outer wall of the heat conduction pipe. The loudspeaker provided by the invention is fixedly connected with the loudspeaker unit in a contact manner by utilizing the hollow heat conduction pipe. The vibration of the loudspeaker monomer is utilized to drive thegas in the heat conduction pipe to flow so as to perform heat radiation on the heat conduction pipe. Furthermore, the heat of the loudspeaker monomer is taken away by the cooled heat conduction pipein a heat conduction manner, so that the purpose of radiating the loudspeaker is achieved.

Description

technical field [0001] The present invention relates to a loudspeaker, in particular to a loudspeaker with a heat dissipation structure. Background technique [0002] With the rapid development of electronic technology, the types of multimedia electronic devices are increasing day by day, such as notebook computer (Notebook), personal computer (Personal Computer, PC), mobile phone (Mobile Phone) and handheld computer (Personal Digital Assistant, PDA). Because people receive external information mainly through vision and hearing, these multimedia electronic devices have electronic components such as displays and speakers to provide visual information and audio information to users. [0003] However, as multimedia electronic devices tend to be thinner and smaller, the volume and heat dissipation space of speakers are gradually compressed, so that the speakers are prone to high temperature under continuous operation, and the speakers are damaged due to the high temperature. C...

Claims

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Application Information

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IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/02H04R9/06H04R2400/11
Inventor 林文弘
Owner ASUSTEK COMPUTER INC
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