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Electronic component manufacturing equipment with impurity removing function

A technology of electronic components and functions, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reducing practicability, pollution, and affecting the effect of chip mounting on the substrate, etc., to achieve strong practicability, The effect of preventing damage

Inactive Publication Date: 2020-12-15
南京利硕斯机电设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the working process of the existing dispensing machine, when the dispensing tube is moving, the glue in the dispensing tube is easy to drip from the dispensing tube under the action of inertia and pollute the wafer or substrate, which reduces the practicability, not only that , when there are impurities on the substrate and contact with the glue, it will affect the effect of chip mounting on the substrate, reducing the practicality

Method used

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  • Electronic component manufacturing equipment with impurity removing function
  • Electronic component manufacturing equipment with impurity removing function
  • Electronic component manufacturing equipment with impurity removing function

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Embodiment Construction

[0027] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0028] Such as Figure 1-3 As shown, a kind of electronic component manufacturing equipment with impurity removal function includes a box body 1 and a dispensing tube 2, the shape of the box body 1 is a cuboid, and the dispensing tube 2 is vertically arranged at the bottom of the box body 1 and connected with the The box body 1 is connected, and the box body 1 is provided with a glue and execution system, and the dispensing pipe 2 is provided with an auxiliary mechanism and a cleaning mechanism;

[0029] The auxiliary mechanism includes a fixed ring 3, a sealing disc 4, a magnet block 5, a moving tube 6, two connecting blocks 7, two reset components and two c...

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Abstract

The invention relates to an electronic component manufacturing equipment with the impurity removing function. The equipment comprises a box body and a dispensing pipe, the box body is in a cuboid shape, the dispensing pipe is vertically arranged at the bottom of the box body and communicates with the box body, glue and an execution system are arranged in the box body, and an auxiliary mechanism and a cleaning mechanism are arranged on the dispensing pipe; the auxiliary mechanism comprises a fixing ring, a sealing disc, a magnet block, a moving pipe, two connecting blocks, two reset assembliesand two connecting assemblies, each reset assembly comprises a guide rod, a first spring, a fixing block and a guide hole, each connecting assembly comprises a sliding block, a limiting block, a fixing rod and a second spring, and the cleaning mechanism comprises two cleaning assemblies. According to the electronic component manufacturing equipment with the impurity removing function, the functionof preventing glue from dripping is achieved through the auxiliary mechanism, and in addition, the function of removing impurities on the substrate is achieved through the cleaning mechanism.

Description

technical field [0001] The invention relates to the field of manufacturing electronic components, in particular to electronic component manufacturing equipment with the function of removing impurities. Background technique [0002] Integrated circuits are a type of electronic components, and during the production process of integrated circuits, glue needs to be dispensed on the substrate by a glue dispenser so that the chip can be glued to the substrate. [0003] During the working process of the existing dispensing machine, when the dispensing tube is moving, the glue in the dispensing tube is easy to drip from the dispensing tube under the action of inertia and pollute the wafer or substrate, which reduces the practicability, not only that , when impurities exist on the substrate and come into contact with the glue, it will affect the effect of chip mounting on the substrate, reducing the practicability. Contents of the invention [0004] The technical problem to be sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 平克宇
Owner 南京利硕斯机电设备有限公司
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