Heat dissipation device and electronic equipment with same

Abstract

The invention discloses a heat dissipation device and electronic equipment with the heat dissipation device. The heat dissipation device comprises a first base body with an inner accommodating cavity,and a second base body with an accommodating cavity, wherein the first base body comprises a cooling part corresponding to a heat source and a connecting part combined and fixed on the second base body; and the inner accommodating cavity comprises a first chamber corresponding to the cooling part and a second chamber corresponding to the connecting part, and the first chamber and the second chamber communicate with each other to form the inner accommodating cavity. The heat dissipation device further comprises: a first capillary core component fixed in the first chamber; a second capillary core component fixed in the second chamber; and a third capillary core component fixed in the accommodating cavity of the second base body, wherein the opposite adjacent ends of the first capillary corecomponent and the second capillary core component are connected and communicate with each other, and the inner accommodating cavity and the accommodating cavity are each filled with a cooling workingmedium. Efficient heat transfer and soaking of a case structure serving as the heat source in different spatial directions are achieved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation. More specifically, it relates to a heat dissipation device and electronic equipment with the heat dissipation device. Background technique [0002] In the space application environment, there is no air convection, and thermal control design can only rely on heat conduction and radiation. Traditional ground fans cannot play a role in space applications. The liquid cooling system has a high heat dissipation capacity, but its system is relatively complex, and its reliability often cannot meet its life requirements in a space environment, and its weight is relatively large. Based on the fact that the integration of space electronic equipment is getting higher and higher, the heat flux density of chips is getting bigger and bigger, the space layout is getting more and more compact, and some equipment has more and more strict requirements on temperature uniformity. High performance, light we...

AI Technical Summary

Problems solved by technology

[0002] In the space application environment, there is no air convection, and the thermal control design can only rely on heat conduction and radiation. Traditional ground fans cannot play a role in space applications.

The liquid cooling system has a high heat dissipation capacity, but its system is relatively complex, and its reliability often cannot meet its life requirements in a space environment, and its weight is relatively large

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