A method for uncovering the pi protective film of a rigid-flex board

Abstract

The invention relates to a method for uncovering the PI protective film of a rigid-flexible board. The method is suitable for uncovering a rigid-flexible board with more than 6 layers. The high-flow glue prepreg is used to make PP, and it is burned by a UV laser machine. A slot with a certain slot width is used for PP window opening. The PP window is located on both sides of the rigid-flexible boundary line and is divided into two parts by the rigid-flexible boundary line; the copper layer corresponding to PP will correspond to the inner edge of PP when the circuit is made. The copper skin in the 0.4mm area is all bitten off; a PI protective film is pasted on the bottom of the bottom PP, and the PI protective film is located in the flexible board area, and the distance from the rigid-flexible junction is 0.25mm; PI protective film, at least one layer of PP and one layer of copper foil are stacked on the flexible board in sequence, and then pressed together, and then the outer layer is made. When the outer layer is made, the CO2 laser process is used to control the depth after the text is printed. The method of uncovering the cover. The method for uncovering the PI protective film of the rigid-flex board of the present invention has the advantages of high efficiency, good quality, and the like.

Description

Technical field[0001]The present invention relates to the field of circuit board production, in particular, a PI protective film disconnection method for rigid bonding plates.Background technique[0002]It is very difficult to remove the flexible zone reinforcing material in the production process of the bonding plate. The existing process FCCL has a high-flu glue semi-curing tablet (Normal Flow PP) of the inner groove, and normal pressing is performed in normal pressing steps. The existing process flow compression process PP fluid is large, and the rigid steel ink near the flexion line is easy to fall off, causing difficulties in unveiling, and the product quality is difficult to ensure that the yield is low, and the productivity is seriously affected.Inventive content[0003]The present invention provides a PI protective film disconnection method for a good product quality and a high production efficiency.[0004]In order to achieve the above object, it is achieved by the following tech...

AI Technical Summary

Problems solved by technology

This kind of existing technological process has a lot of PP glue flow during the pressing process, and the ink on the rigid board near the rigid-flexible boundary line is easy to fall off, which makes it difficult to remove the cover, difficult to guarantee product quality, low yield rate, and seriously affects production efficiency.

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