Low-frequency sound insulation cellular board

A honeycomb panel and sound insulation technology, which is applied in the direction of paper/cardboard layered products, layered products, metal layered products, etc., can solve the problems of poor low-frequency sound insulation performance, and achieve low-frequency sound insulation and low-frequency sound insulation performance Highlight and ensure lightweight effect

Pending Publication Date: 2020-12-04
HUNAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a low-frequency sound insulation honeycomb panel that solves the poor low-frequency sound insulation performance of existing lightweight panels

Method used

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  • Low-frequency sound insulation cellular board
  • Low-frequency sound insulation cellular board
  • Low-frequency sound insulation cellular board

Examples

Experimental program
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Effect test

Embodiment 1

[0044] Embodiment 1, low-frequency sound insulation honeycomb panel, such as Figure 1-4 As shown, it is formed by bonding an upper panel 1, an upper honeycomb layer 2, an elastic film 3, a lower honeycomb layer 5 and a lower panel 6 in sequence.

[0045] A mass vibrator 4 is embedded in the elastic film 3 .

[0046] The honeycomb cells of the upper honeycomb layer 2 and the lower honeycomb layer 5 divide the elastic film 3 into several elastic units, and these elastic units form a honeycomb structure. The elastic film 3 is distributed with mass vibrators 4 on each elastic unit, forming a mass vibrator array.

[0047] The mass vibrator 4 is located at the very center of the elastic unit, and each mass vibrator 4 and the corresponding elastic unit form a miniature dynamic vibration absorber. The mass vibrator 4 can pass through the elastic film 3 and extend into the elastic units on both sides, or it can be placed on the surface of the elastic film 3. In both ways, the mass v...

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Abstract

The invention provides a low-frequency sound insulation cellular board. The low-frequency sound insulation cellular board is formed by sequentially bonding an upper panel, an upper cellular layer, anelastic film, a lower cellular layer and a lower panel, the elastic film is divided into a plurality of elastic units by honeycomb cells of the upper cellular layer and the lower cellularlayer, and mass oscillators are uniformly distributed on each elastic unit of the elastic film to form a mass oscillator array; the a mass oscillator arrays are formed; each mass oscillator and the corresponding elastic unit are adopted to form a miniature dynamic vibration absorber. According to the invention, the light weight of the plate is ensured, and the outstanding low-frequency sound insulation performance is ensured; according to the characteristics of a noise source, the sound reduction index characteristics of the board can be designed in a targeted manner.

Description

technical field [0001] The invention relates to a low-frequency sound-insulating honeycomb panel, which belongs to the technical field of sound-insulating panels. Background technique [0002] With the high-speed and lightweight requirements of vehicles (high-speed rail, super train, aircraft), the noise is getting louder, and people's requirements for noise comfort are getting higher and higher, so it is necessary to find better sound insulation performance. The board is used to isolate the noise from the noise source to the passenger space. [0003] For traditional panels, whether they are single-layer panels or multi-layer panels, in the low frequency band, the sound insulation is subject to the law of mass, even lower than the sound insulation given by the law of mass. The mass law shows that in the low frequency band, the sound insulation of the plate structure is very small, and it is difficult to meet the requirements of the sound insulation performance of materials ...

Claims

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Application Information

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IPC IPC(8): B32B15/18B32B15/20B32B15/04B32B3/12B32B15/12B32B29/00B32B15/085B32B15/06B32B25/20B32B25/06B32B27/10B32B27/32B32B3/08
CPCB32B15/18B32B15/20B32B15/043B32B3/12B32B15/12B32B29/00B32B15/085B32B15/06B32B25/20B32B25/06B32B27/322B32B27/10B32B3/085B32B2307/102
Inventor 罗竹辉刘磊陈颖
Owner HUNAN UNIV OF TECH
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