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Vapor deposition apparatus and method for producing organic electronic device

A technology of evaporation and organic materials, applied in the direction of electric solid devices, electrical components, vacuum evaporation plating, etc., can solve the problem of not further accommodating large components, and achieve the effect of reducing the risk of adverse effects, reducing losses, and reducing burdens

Pending Publication Date: 2020-11-20
FUKUOKA IND SCI & TECH FOUND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

exist Figure 16 Various cables and components are gathered in the space 120 under the medium and vacuum chambers 111, and it can be seen that there is no room for further accommodating large components

Method used

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  • Vapor deposition apparatus and method for producing organic electronic device
  • Vapor deposition apparatus and method for producing organic electronic device
  • Vapor deposition apparatus and method for producing organic electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] figure 1 A partial cross-sectional view of the vapor deposition device 1 (an example of the "vapor deposition device" in the claims of the present invention) of Example 1 is shown. The vapor deposition device 1 has: a container 3 (an example of a "container" in the claims of the present invention), a container holder 5, a coil 7 (an example of a "coil" in the claims of the present invention), a power semiconductor 9 (an example of a "coil" in the claims of the present invention), An example of the required "power semiconductor", a vacuum chamber 11 (an example of the "vacuum chamber" in the claims of the present invention), a DC power supply 15 (an example of the "DC power supply" in the claims of the present invention), and cable16. The container 3 is used to accommodate the organic material 17 . The container holder 5 is used to hold the container 3 . The coil 7 is wound around the container 3 . The power semiconductor 9 is electrically connected to the DC power ...

Embodiment 2

[0079] Image 6 It is a cross-sectional view showing a part of the vapor deposition device 61 of Example 2. The vapor deposition device 61 has a container 63 , a coil 65 , a power semiconductor 67 , a vacuum chamber 69 , a DC power supply 71 , and a cable 73 . The main difference between the vapor deposition device 61 and the vapor deposition device 1 is that the coil 65 is arranged outside the vacuum chamber 69 .

[0080] Specifically, the vacuum chamber 69 includes a chamber bottom 75 and a chamber upper 77 . The chamber bottom 75 is connected to the chamber top 77 by an O-ring 79 connection. The container 63 for storing the organic material 81 is arranged inside the chamber bottom 75 . Furthermore, the coil 65 surrounds the container 63 from the outside of the chamber bottom 75 .

[0081] like Image 6 As shown, the coil 65 and the container 63 pass through the structure separated by the vacuum chamber 69, and the organic material 81 will no longer adhere to the coil 6...

Embodiment 3

[0094] Next, refer to Figure 12 and Figure 13 , in this embodiment, the heating control by frequency control will be described. Figure 12 It is a graph showing the relationship between the AC frequency flowing into the coil and the input energy. Figure 13 It is a graph showing the relationship between the frequency range and the heating temperature.

[0095] like Figure 12 As shown in the schematic diagram, the maximum reachable temperature changes by frequency control using a frequency control unit such as a function generator. This demonstrates that heating control becomes possible by performing frequency control.

[0096] Furthermore, the control of voltage and current can only be controlled linearly in the past, but the present invention can perform nonlinear control through frequency control. Specifically, as Figure 13 As shown in the schematic diagram, in the frequency range near the resonance frequency, the maximum attained temperature changes only slightly ...

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PUM

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Abstract

The purpose of the present invention is to provide: a practical vapor deposition apparatus which is suppressed in noise during the formation of a film of an organic material by means of induction heating; and the like. A vapor deposition apparatus for forming a film of an organic material on a substrate, which is provided with: a container, at least a part of which is configured from a conductor,and which contains the organic material; a coil which is arranged around the container; a power semiconductor which is connected to the coil; and a direct-current power supply which is connected to the power semiconductor. This vapor deposition apparatus is configured such that the power semiconductor functions as a transistor that constitutes a part of an inverter part which converts a direct current into an alternating current. By using a power semiconductor and a direct-current power supply, a large-sized alternating-current power supply becomes unnecessary. Consequently, it becomes easy for this vapor deposition apparatus to have a compact configuration.

Description

technical field [0001] The present invention relates to a vapor deposition device and a production method of an organic electronic device, in particular to a vapor deposition device and the like for forming a film of an organic material on a substrate. Background technique [0002] The inventors of the present application have proposed a vapor deposition device for forming a film of an organic material on a substrate, which is a vapor deposition device for performing induction heating (Patent Document 1). The induction heating method is more excellent in thermal responsiveness than the resistance heating method. Therefore, heating and cooling can be performed quickly, and precise temperature control can be performed. [0003] Generally speaking, the vapor deposition device of organic material adopts the resistance heating method. Figure 16 is a schematic diagram of a resistance heating system vapor deposition apparatus. exist Figure 16 Among them, the vapor deposition ap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/12H05B6/04H10K99/00
CPCC23C14/243C23C14/26H05B6/06H10K71/164C23C14/12H05B6/04C23C14/24H10K71/00
Inventor 小林慎一郎藤本弘宫崎浩
Owner FUKUOKA IND SCI & TECH FOUND
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