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Circuit board and server

A circuit board and via technology, applied in circuit substrate materials, printed circuits, printed circuit manufacturing, etc., can solve problems such as electrical signal distortion, and achieve the effects of increasing stability, weakening energy coupling, reducing attenuation and transmission loss.

Inactive Publication Date: 2020-11-20
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a circuit board and a server to solve the technical problems in the prior art that easily cause distortion of electrical signals

Method used

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  • Circuit board and server
  • Circuit board and server
  • Circuit board and server

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as figure 1 with figure 2 As shown, the circuit board includes a prepreg layer 10 and a first reference layer 20 , and a first insulating layer (not shown) between the prepreg layer 10 and the first reference layer 20 . A signal line is formed in the prepreg layer 10 , and the signal line includes two parallel wires 11 . In this embodiment, a high-speed line is used as an example for illustration.

[0031] Prepreg 10 is mainly made of prepreg as raw material. Prepreg is also called PP sheet, which is a commonly used material in the production of multi-layer boards. It is mainly composed of resin and reinforcing materials. The reinforcing materials can be glass fiber cloth, paper base, and composite materials. There are several types, and most of the prepregs (adhesive sheets) used in the production of multilayer printed circuit boards use glass fiber cloth as a reinforcing material.

[0032] Both sides of the high-speed line are provided with via holes 12 penetr...

Embodiment 2

[0040]An embodiment of the present invention provides a circuit board, which is basically the same as the circuit board provided in Embodiment 1. The difference is that, as Figure 5 As shown, on the basis of the first embodiment, in this embodiment, at least one conductor layer is further included on the side of the prepreg layer 10 away from the first reference layer 20 . The at least one conductor layer may include a second reference layer 30, because the second reference layer 30 is the conductor layer closest to the prepreg layer 10, so a second insulating layer is arranged between the prepreg layer 10 and the second reference layer (not shown in the figure). Of course, every two adjacent conductor layers are also directly provided with insulating layers.

[0041] Wherein, the production process of the prepreg can be as follows: first, the treated glass fiber cloth is impregnated with resin glue, and then heat-treated (pre-baking) to make the thin sheet material made of...

Embodiment 3

[0046] An embodiment of the present invention provides a circuit board, which is basically the same as the circuit board provided in Embodiment 1. The difference is that, as Image 6 As shown, a plurality of via holes 12 are respectively provided on both sides of the signal line. For example, when the length of the high-speed line is relatively large (more than 3 inches), a via hole 12 can be provided at a certain distance so that each area of ​​the high-speed line The electric field of the segment can get a better convergence effect.

[0047] In a possible implementation manner, on each side of the signal line, the pitch of the via holes 12 can be set at 200 to 400 mil (1 mil=1 / 1000 inch=0.0254mm). For example, a via hole 12 is arranged at an interval of 300 mils on each side of the signal line, such density can control the overall transmission loss of the high-speed line to a low level.

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Abstract

The invention provides a circuit board and a server, and relates to the technical field of electronic devices. The circuit board comprises a semi-solidified layer, a first reference layer and a firstinsulating layer located between the semi-solidified layer and the first reference layer. A signal line is formed in the semi-solidified layer, and the signal line comprises two parallel lines; via holes penetrating through the first insulating layer are formed in the two sides of the signal line, conductor materials are formed on the inner walls of the via holes, and the semi-solidified layer iselectrically connected with the first reference layer through the conductor materials; and a technical problem that in the prior art, electric signal distortion is likely to be caused is solved.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to a circuit board and a server. Background technique [0002] As a kind of computer, the server provides computing, storage, data exchange and other services for Internet users, and is an important component node in the Internet era. The server has the characteristics of high computing speed, long running time, and large data throughput, and the hardware of the server mainly includes circuit boards and mechanism devices. Among them, the circuit board is responsible for the transmission, conversion of electric energy, and the transmission and processing of signals. There are thousands of signal lines on the circuit board. These lines need to run for a long time, so the role of the signal is also extremely important. On the one hand, it ensures It not only ensures the efficient and stable operation of the server, but also greatly reduces the operating cost of the data cen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/05H05K1/02H05K3/00
CPCH05K1/05H05K1/0298H05K3/0044
Inventor 刘法志
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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