Stamping device for new ceramic material stamping

A technology of ceramic material and stamping device, which is applied in the field of new material stamping, can solve the problems of clogging of stamping holes, affecting the accuracy of mold shape, etc., and achieve the effect of avoiding clogging

Active Publication Date: 2020-11-20
南京展研新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the invention provides a new type of stamping device for stamping ceramic materials, which has the advantages of cleaning the punching holes and collectin

Method used

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  • Stamping device for new ceramic material stamping
  • Stamping device for new ceramic material stamping
  • Stamping device for new ceramic material stamping

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Embodiment Construction

[0027] The technical solutions in the embodiments of the invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the invention, rather than all the embodiments. Based on the embodiments in the invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of the invention.

[0028] See Figure 1-6 , A new type of stamping device for ceramic material stamping, including a bracket assembly 1, a bracket assembly 1, and a drive device 2 fixedly installed on the support assembly 1. The drive device 2 includes a guide cylinder 21 and a telescopic column 22, and the telescopic column 22 is fixed below The upper template 3 is connected with a slot 31, the left part of the upper template 3 is provided with a sealing cylinder 32, the inside of the seal...

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Abstract

The invention relates to the technical field of new material stamping, and discloses a stamping device for new ceramic material stamping. The stamping device comprises a support assembly, wherein thesupport assembly is fixedly provided with a driving device; the driving device comprises a guide cylinder and a telescopic column, an upper die plate is fixedly connected to the position below the telescopic column, and the upper die plate is provided with an open groove; and a sealing cylinder is arranged on the left portion of the upper die plate, a gas guide pipe is arranged at the upper end ofthe sealing cylinder, an elastic gas bag is fixedly connected to the upper end of the gas guide pipe, and an extrusion plate is arranged below the elastic gas bag. According to the stamping device for new ceramic material stamping, when the die plate moves upwards after die casting, an extrusion column can be driven to move upwards, and the extrusion plate extrudes the elastic gas bag, so that gas inside the elastic gas bag is compressed to enter the sealing cylinder through the gas guide pipe; and the gas entering the sealing cylinder pushes a piston to move, and a push rod moves downwards to drive a cleaning sheet to scrape residual materials inside a stamping hole, so that the residual materials in the stamping hole are cleared to avoid affecting the accuracy of the next die casting.

Description

Technical field [0001] The invention relates to the technical field of stamping of new materials, in particular to a stamping device for stamping of new ceramic materials. Background technique [0002] As people's research on materials becomes more and more in-depth, more and more new materials are applied. The use of new materials can be seen everywhere in production and life. One of the new ceramic materials has the advantages of high temperature resistance, heat insulation and insulation. Gradually applied to the connection of cable insulation wires, this new type of ceramic material often requires multiple processes before use. For this reason, a new type of stamping device for ceramic material stamping is proposed to stamp new materials. [0003] For the stamping of new materials, stamping devices are often used. After a stamping process on the stamping device, the stamping holes on the template are often adhered to residual materials. At present, there is no good solution for...

Claims

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Application Information

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IPC IPC(8): B28B3/04B28B17/04
CPCB28B3/04B28B17/04
Inventor 何荣霞
Owner 南京展研新材料科技有限公司
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