a reflow carrier

A carrier and bottom plate technology, applied in manufacturing tools, metal processing equipment, welding equipment, etc., can solve problems such as uneven pins and false soldering of pins

Active Publication Date: 2022-02-25
华羿微电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a reflow carrier, which is used to solve the problem of false soldering of the pins at higher positions due to the uneven height of the pins when the existing high-hardness lead frame is welded to the heat-dissipating substrate.

Method used

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Embodiment Construction

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] figure 1 It is a schematic diagram of the welding assembly of DIP products and PCB circuit boards in traditional technology; figure 2 It is a schematic diagram of the welding seam between the DIP product and the PCB circuit board in the traditional technology; image 3 It is a schematic diagram of the assembly of a press-fit pin DIP product and a PCB circuit board in the prior art; Figure 4 It is a schematic diagram of the ...

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Abstract

The invention discloses a reflow carrier, which relates to the technical field of automobile-level intelligent power semiconductor module manufacturing. It is used to solve the problem of false soldering of the pins due to the uneven height of the pins of the high-hardness lead frame. Including: reflow carrier base plate and reflow carrier metal cover plate; reflow carrier base plate includes substrate limit groove, frame limit groove, coarse positioning groove and fine positioning pin; substrate limit groove is used to set heat dissipation substrate, frame limit The groove is used to set the high-hardness lead frame, and the coarse positioning groove and the fine positioning pin are used to set the metal cover plate of the reflow carrier; the metal cover plate of the reflow carrier includes an operating handle, a first bump and a first pressure connector; the operating handle The position corresponds to the position of the coarse positioning groove; a plurality of first bumps are respectively in contact with the surface of the pin line included in the high-hardness lead frame; the first pressure connection part is connected to the second pressure connection on the bottom plate of the reflow Matching parts, fix the metal cover plate of the reflow carrier on the bottom plate of the reflow carrier.

Description

technical field [0001] The invention relates to the technical field of automotive-grade intelligent power semiconductor module manufacturing, and more particularly to a reflow carrier. Background technique [0002] Traditionally, power semiconductor module products with DIP (English: dual in-line package, Chinese: dual in-line package) package design need to be wave soldered to install the product on the PCB (English: PrintedCircuit Board, Chinese for printing Circuit board) circuit board, wave soldering has high requirements on the flatness of the PCB circuit board, and it is easy to have problems such as missing soldering, bridging, and virtual soldering during the entire wave soldering process. At the same time, due to the high temperature during the soldering process , PCB circuit board is also prone to warping deformation, delamination and other undesirable phenomena. In order to solve the above problems, an intelligent power semiconductor module product with a press-f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/00B23K3/08
CPCB23K3/00B23K3/085B23K3/082
Inventor 蒋卫娟孙炎权郑阳斌
Owner 华羿微电子股份有限公司
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