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Wafer test micro probe based on micro electro mechanical system

A technology for micro-electromechanical systems and wafer testing, which is used in the testing of single semiconductor devices, components of electrical measuring instruments, and processes used to produce decorative surface effects. Chips, improve electrical conductivity, improve the effect of mechanical wear life

Pending Publication Date: 2020-11-13
SUZHOU TAOSHENG ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional spring probes can no longer meet the test requirements of small spacing, and now it is urgent to develop a new structure of micro-probes to meet the existing small spacing test is very necessary

Method used

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  • Wafer test micro probe based on micro electro mechanical system
  • Wafer test micro probe based on micro electro mechanical system
  • Wafer test micro probe based on micro electro mechanical system

Examples

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Embodiment Construction

[0024] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "middle", The orientation or positional relationship indicated by "内" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, It is constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of these fe...

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Abstract

The invention discloses a wafer test micro probe based on a micro electro mechanical system. The probe comprises a probe main body, the probe main body is of an approximately L-shaped structure, the probe main body comprises a first end part, a second end part and a connecting part located between the first end part and the second end part and used for connecting the first end part and the secondend part, a groove parallel to the connecting part is formed in the connecting part, and the groove penetrates through the connecting part front and back. The probe provided by the invention can be used for testing chips with small spacing.

Description

Technical field [0001] The invention relates to the field of semiconductor testing equipment, and more specifically, is a micro-electromechanical system-based wafer testing micro probe. Background technique [0002] With the continuous improvement of chip manufacturing processes, the periphery of the chip package has become smaller, resulting in smaller and smaller chip lead distances. Traditional spring probes can no longer meet the test requirements of small pitches. Now it is very necessary to develop a new structure of micro probes to meet the existing small pitch tests. Summary of the invention [0003] The purpose of the present invention is to provide a micro-electromechanical system-based wafer test micro-probe. The probe of the invention can be used for micro-pitch chip test. [0004] The technical scheme is as follows: [0005] The micro-probe for wafer testing based on MEMS includes a probe body which has an approximate "L"-shaped structure. The probe body includes a firs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R31/26B81C1/00
CPCG01R1/06716G01R1/06761G01R31/2601B81C1/0038B81C1/00111B81C1/00674B81C1/00682B81C2201/0174G01R1/07357
Inventor 刘凯殷岚勇
Owner SUZHOU TAOSHENG ELECTRONICS TECH CO LTD
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