Surface light emitter and production method therefor

Abstract

To provide: a novel surface light emitter configured so to be able to efficiently dissipate heat, which is generated by LED elements as a result of emitting light, externally, while having a simple structure; and a production method therefor. This surface light emitter (1) is characterized by comprising a substrate (11) on which a suitable circuit pattern (12) is formed, and a plurality of LED elements (13) that are substantially regularly positioned on the substrate (11), wherein the primary raw material of the substrate (11) is an insulating radiation- and heat-dissipating material such as clay, and the substrate (11) is formed by a composite material in which resins are combined. In addition, the circuit pattern (12) is formed by a conductive adhesive, and the LED elements (13) are preferably bonded on the substrate (11) by means of the conductive adhesive.

Description

technical field [0001] The present invention relates to a novel surface light emitting body and its manufacturing method. The surface light emitting body is formed by mounting a plurality of LED elements on a base material with a suitable circuit pattern, especially it can emit light from the LED The heat generated by the element is efficiently dissipated to the outside. Background technique [0002] Surface light emitting bodies using LED (Light Emitting Diode: Light Emitting Diode) elements are widely used today (for example, refer to Patent Document 1). Its basic structure includes a base material (substrate) on which an appropriate circuit pattern is formed, and a plurality of LED elements arranged substantially regularly on the substrate. [0003] However, in such a surface light emitter, since the LED element emits a large amount of heat accompanying light emission, how to dissipate this heat to the outside is a technical problem (for example, refer to Patent Document...

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Problems solved by technology

[0008] However, even in this case, the insulating layer M is still provided under the circuit pattern 12', so even if the thermal diffusion material ALC as described above is provided, It is undeniable that heat is still difficult to pass through the insulating layer M, and further improvement is required

[0009] In addition, even if the heat generated from the LED element 13' is smoothly transferred to the aluminum plate AL, for example, it is difficult to transfer heat to the base member provided with the surface light emitter 1'. In the case of materials such as wooden floor or wall, heat is still easy to accumulate in the surface illuminator 1' (aluminum plate AL)

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