A kind of flux cleaning agent for chip encapsulation process

Abstract

The invention discloses a flux cleaning agent for a chip packaging process. Its components and weight percentages are: fluorinated organic matter: 2-8%; glycerol ether: 20-40%; N,N-dimethylacetamide: 5‑15%; Mercaptobenzothiazole: 1‑5%; Ethanol: 20‑30%; the balance is water. The cleaning agent is added with fluorinated organic substances with strong electron-absorbing ability, which has excellent wetting effect, and can effectively act on blind holes, crevices and other difficult-to-wet surfaces; It has good dissolution and removal ability with rosin and glue, good low-temperature cleaning effect, and fast degreasing speed; 2-mercaptobenzothiazole as a metal corrosion inhibitor reduces the corrosion effect of cleaning agents on metals; ethanol improves the cleaning agent. The quick-drying feature avoids the corrosion of pads or pins caused by untimely drying.

Description

technical field [0001] The invention relates to the technical field of materials in the electronic industry, in particular to a flux cleaning agent for chip packaging technology. Background technique [0002] In the processing technology of electronic information products, the cleaning of SMT (Surface Mount Technology) printed screen boards, wave crest stoves, reflow stoves, and PCBA (Assembled Circuit Boards) will consume a large amount of cleaning agents every year. Generally, in the assembly and welding process of PCB, in order to ensure the reliability of welding, it is necessary to use highly active flux. These fluxes remain on the PCBA, which will corrode the circuit board and components, and reduce its surface insulation resistance, especially In a high-temperature and high-humidity environment, severe corrosion and leakage will occur, which will affect the reliability of the whole machine. At present, the flux has been gradually developed and applied as a no-cleanin...

AI Technical Summary

Problems solved by technology

However, the semi-water-based cleaning technology has the following disadvantages: long process flow, high operating cost, and large amount of wastewater treatment; metals are prone to corrosion and discoloration during rinsing with pure water; they still contain volatile organic compounds, etc.

But my country's water-based cleaning agent also has the following deficiencies: 1. For many sticky waxy dirt, such as rosin, glue, and blind holes and gaps on the workpiece, the cleaning effect of hydrophobic parts is poor. The current water-based cleaning After cleaning the PCBA with a cleaning agent, the surface of the board is generally prone to whitening; Ⅱ. The residues after cleaning with some water-based cleaning agents are difficult to rinse off, especially the residues in blind holes and gaps. These residues may affect subsequent processes or Influenced by application; Ⅲ. The low-temperature cleaning effect is poor, and the degreasing speed is slow, which cannot be compared with the solvent type; Ⅳ. If the metal parts are not dried in time, they are prone to corrosion, such as steel mesh, pads on PCBA and pins of components V. Lack of special multi-effect surfactants suitable for industrial cleaning, etc.

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