A kind of processing method of server, server chassis and server chassis

A processing method and server technology, applied in the server field, can solve problems such as prolonging the product processing cycle, reducing product heat dissipation performance, and increasing R&D costs, so as to save time for developing and making molds, reduce changes in hole size, and reduce production costs. Reduced effect

Active Publication Date: 2022-05-24
INSPUR SUZHOU INTELLIGENT TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, according to the above changes will produce corresponding disadvantages
First of all, in order to ensure the safety of heat dissipation, at the same hole density, the larger the hole, the better the heat dissipation effect. However, the hole diameter changes from 5mm to 3mm. Under the same hole density, the heat dissipation performance of the product will be reduced, which will affect the product design. reliability
Secondly, the products in the industry are all designed according to the hole diameter of 5mm. Since the hole diameter changes from 5mm to 3mm, all the many 5mm hole molds that were originally used will be scrapped, resulting in great waste and cost commission. It is necessary to re-make the 3mm opening mold, and re-opening the mold will cause a large-scale increase in R&D costs and prolong the product processing cycle

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of processing method of server, server chassis and server chassis
  • A kind of processing method of server, server chassis and server chassis
  • A kind of processing method of server, server chassis and server chassis

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0050]The core of the present invention is to provide a server case, which can ensure the reliability of products, and the case is easy to meet the requirements of safety regulations. Another core of the present invention is to provide a processing method of a server case, the server case processed by the method can ensure the reliability of the product on the basis of satisfying the safety regulations.

[0051] The present applicatio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a server, a server case and a processing method for the server case. The server case includes a shell with a bottom plate and a rear window, and components are arranged in the shell, and the components are directed toward the bottom plate and have a preset expansion angle. In the PIS flame area, the rear window is provided with a shield, which is used to shield the PIS flame area, so that the rear window has a shielding part that is not in the PIS flame area; the shielding part is provided with a first cooling hole, and the PIS flame area of ​​the bottom plate A second heat dissipation hole is arranged inside, and the first heat dissipation hole is larger than the second heat dissipation hole. In the present invention, a cover is provided on the rear window, so that the covered part does not belong to the projection range of the PIS flame area. Due to the setting of the cover, the heat dissipation holes on the rear window can maintain the original large-diameter holes, and meet the new standard. Under certain circumstances, the change of the opening size is reduced, the original mold can be continued to be used, and the manufacturing cost of the server chassis is reduced.

Description

technical field [0001] The present invention relates to the technical field of server structure design, and more particularly, to a server chassis and a server. In addition, the invention also relates to a processing method of a server case. Background technique [0002] Safety regulations refer to the requirements for product safety in product certification. Products from design, sales, to end users, throughout the entire life cycle of product use, relative to the laws, regulations and standard product safety compliance of the place of sale. This product safety compliance not only includes product safety in the general sense, but also includes requirements for electromagnetic compatibility and radiation, energy conservation and environmental protection of products, and is a product safety responsibility and activity throughout the product life cycle. [0003] The update of safety standards usually leads to great changes in product design. The changes in product design caus...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 田立良
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products