Semiconductor refrigerating and heating automobile air conditioner

Abstract

The invention discloses a semiconductor refrigeration and heating automobile air conditioner, and the air conditioner comprises a first semiconductor refrigeration sheet, wherein a metal heat conduction plate is fixedly installed on one side of the first semiconductor refrigeration sheet, and a second semiconductor refrigeration sheet is fixedly installed on one side of the metal heat conduction plate. According to the semiconductor refrigeration and heating automobile air conditioner, the semiconductor refrigeration efficiency problem is solved, and large-scale refrigeration can be achieved;therefore, by means of the advantage that an automobile has a direct-current power source, the cost of a direct-current power source device is saved, much cost of the semiconductor refrigeration and heating automobile air conditioner can be reduced, and the semiconductor heating efficiency is permanently larger than 1; the energy efficiency ratio is generally between 1 and 2, if the heat exchangeprocess is optimized and an overlapping scheme is adopted, it is possible that the refrigerating efficiency is close to that of a traditional compressor, and if the optimal value of the semiconductormaterial is further improved in the future, the refrigerating efficiency can further exceed that of the traditional compressor.

Description

technical field [0001] The invention relates to the technical field of electronic machinery, in particular to a semiconductor refrigeration and heating automobile air conditioner. Background technique [0002] A piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form a galvanic stack, and many galvanic stacks are connected in series to form a semiconductor cooling chip. In principle, the peltier is a tool for heat transfer. When a current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form cold and heat. end. However, the semiconductor itself has resistance. When the current passes through the semiconductor, heat will be generated, which will affect the heat transfer. Moreover, the heat betw...

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Problems solved by technology

In addition, the galvanic stack components used are made of high-purity rare materials, and the process conditions are not yet mature, resulting in relatively high cost of components, which greatly limits the wide application in the field of general refrigeration

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