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A kind of encapsulation carrier board, encapsulation body and technology thereof

A technology for packaging a carrier board and a package body, applied in the field of electronics, can solve the problems of large investment, limited size and thickness, high equipment and technical thresholds, and achieve the effects of improving production efficiency, avoiding wire bonding and simple structure

Active Publication Date: 2022-01-25
深圳市鼎华芯泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As far as packaging technology is concerned, mainstream packaging substrates mostly use HDI technology, the core of which lies in the formation of micro-hole conduction and thin lines. material, and the size and thickness are limited by the material specification

Method used

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  • A kind of encapsulation carrier board, encapsulation body and technology thereof
  • A kind of encapsulation carrier board, encapsulation body and technology thereof
  • A kind of encapsulation carrier board, encapsulation body and technology thereof

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Embodiment Construction

[0032] The following is attached Figure 1-1 to Figure 10-9 The features and advantages of the disclosure will be apparent from the more particular description of the preferred embodiment of the disclosure shown.

[0033] see Picture 1-1 , in one embodiment, which discloses a package carrier:

[0034] The packaging carrier is used to carry a package including a chip;

[0035] The packaging carrier includes: a carrier sheet and a medium thinner than the carrier sheet;

[0036] The medium includes any of the following: a release film, a transition coating, or other medium capable of forming a weak bond with the package or the carrier sheet;

[0037] For at least one side of the carrier sheet, a part of its area belongs to the medium area to which the medium is attached, and the remaining part of the area includes at least a first area and a second area, and: the first area belongs to the area on which the medium is connected. The area where the first metal electrode of the c...

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Abstract

A packaging carrier for carrying a package including a chip, including: a carrier sheet and a medium thinner than the carrier sheet; the medium includes any of the following: a release film, a transitional coating, or other materials that can be combined with the package or the carrier The sheet forms a medium with weak bonding force; for at least one side of the carrier sheet, a part of the area belongs to the medium area, and the rest of the area includes at least the first area and the second area, and the first area belongs to the first area on which the chip is connected. A region to which a metal electrode is attached, the second region belongs to the second region to which a second metal electrode connected with a dummy sheet is attached, and the thickness of the dummy sheet is consistent with the thickness of the chip; the carrier sheet can be relative to the package The body is stripped and reused for encapsulating the carrier. In this way, the present disclosure realizes a packaging carrier board that is simpler, avoids wire bonding to the greatest extent, is more environmentally friendly, and lower in cost.

Description

technical field [0001] The disclosure belongs to the field of electronics, and in particular relates to a packaging carrier. Background technique [0002] The integrated circuit industry is the basic and leading industry of the information society, among which, the packaging and testing of various integrated circuits is an important link in the entire industrial chain. As far as packaging technology is concerned, mainstream packaging substrates mostly use HDI technology, the core of which lies in the formation of micro-hole conduction and thin lines. material, and the size and thickness are limited by the material specification. [0003] How to design a simpler, more environmentally friendly, and lower-cost packaging carrier and its supporting process is a technical problem that the packaging industry needs to solve urgently. Contents of the invention [0004] Aiming at the deficiencies of the prior art, the present disclosure discloses a packaging carrier, which is char...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/12H01L23/31
CPCH01L21/568H01L23/12H01L23/31H01L2224/18
Inventor 何雨桐何忠亮沈洁胡大海李金样
Owner 深圳市鼎华芯泰科技有限公司
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