Packaging mechanism and packaging method for pressure sensor chip packaging and testing

Abstract

The invention discloses a packaging mechanism and a packaging method for the packaging and testing of pressure sensor chips. Two injection molded parts are arranged on the surface of the cover plate, and linkage part 1, linkage part 2 and linkage part 3 are also included. Under the action of linkage part 1, the electrical connection between the sensor chip and the PCB board is driven, through the injection molded part, and under the joint action of linkage part 1 and linkage part 2, the fixed connection between the cover plate and the substrate is driven, and through the injection molded part, And under the joint action of the linkage part 1 and the linkage part 3, the fixed connection between the copper nut and the PCB board is driven. The present invention has the effect that the pressure sensor chip can be packaged by moving the two limit posts upwards, and the package is convenient and fast. At the same time, the silicone gel can be injected into the cover plate through the injection molding channel to fill the sensor chip. The four sides of the sensor chip are sealed and protected, and the silicone gel can fill the inner cavity of the cover plate.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a packaging mechanism and a packaging method for pressure sensor chip packaging and testing. Background technique [0002] The pressure sensor senses the pressure signal through the pressure sensitive unit, and can convert the pressure signal into an available output electrical signal according to certain rules, and then processed by the signal processing unit into the corresponding analog output or digital output form. [0003] For example, the pressure sensor medium isolation packaging structure disclosed in the reference document Chinese patent CN201310123972.5, publication date: 20141015, the reference document includes a tube base, a tube cap, a pressure sensor chip, a substrate and a fluid tube. The tube base is provided with a through hole and fixed on the Above the substrate, the pressure sensor chip is pasted on the tube base and covers the through hole. The press...

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Problems solved by technology

[0004] However, although this reference document omits other media isolation technologies such as a series of complicated processes such as oil filling, and has a more compact structure, it needs The electrical connection between the sensor chip and the PCB board, the fixed connection between the PCB board and the tube base, and the fixed connection between the cover plate and the tube base are performed in sequence. The packaging process is cumbersome, and after filling the silicone gel around the sensor chip, then When the cover plate and the tube base are fixedly connected, there is a gap between the silicone gel and the cover plate, which makes the silicone gel easy to shake, which in turn affects the sensor chip wrapped by the silicone gel

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