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High-thermal-conductivity composite gel and preparation method thereof

A composite gel, high thermal conductivity technology, applied in gel preparation, chemical instruments and methods, colloid chemistry, etc., can solve the problem of not fully exerting the advantages of diamond thermal conductivity.

Pending Publication Date: 2020-10-27
彗晶新材料科技(张家港)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the current application is to mix untreated or simple coupling agent-treated diamond particles with the base material, which has not fully exerted the advantages of diamond in thermal conductivity, so that the thermal conductivity of the prepared thermal conductive material is still low. There is a lot of room for improvement

Method used

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  • High-thermal-conductivity composite gel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] The thermally conductive gel provided in this example includes the following components by weight: 1000 parts by weight of diamond particles with a particle size of 0.5-65 μm, 50 parts by weight of hydroxy silicone oil with a viscosity of 300 cps, 15 parts by weight of trimethoxysilane, and a coupling agent, ampropanol 5 parts by weight of trimethoxysilane and 0.5 parts by weight of titanium as a catalyst of 1,2 propyldioxyethylene diacetoacetate ethyl.

[0062] The preparation steps of the thermally conductive gel are:

[0063] (1) According to the above parts by weight, the diamond particles with a particle size of 0.5 to 65 μm are fully ground and dispersed in a mortar;

[0064] (2) Put the ground and dispersed diamond particles into a vacuum heat treatment furnace, and perform a vacuum high-temperature heat treatment at 1250°C for 1 hour, keeping the vacuum degree in the furnace not lower than 1×10 -4 Pa;

[0065] (3) The diamond particles and the coupling agent t...

Embodiment 2

[0069] The thermally conductive gel provided in this embodiment includes the following components by weight: 1000 parts by weight of diamond particles with a particle size of 1 μm, 50 parts by weight of alumina with a particle size of 1-25 μm, and 100 parts by weight of aluminum oxide with a particle size of 25-45 μm Parts, 50 parts by weight of alumina with a particle size of 45-90 μm, 60 parts by weight of 300-viscosity hydroxyl silicone oil, 25 parts by weight of trimethoxysilane, 8 parts by weight of coupling agent aminopropyltrimethoxysilane and 1,2 parts by weight of catalyst 1 part by weight of ethyl dioxyethylene diacetoacetate titanium.

[0070] The preparation steps of the thermally conductive gel are:

[0071] (1) by the above parts by weight, first the diamond particles with a particle diameter of 1 μm are fully ground and dispersed;

[0072] (2) Put the ground and dispersed diamond particles into a vacuum heat treatment furnace, and perform a vacuum high-temperat...

Embodiment 3

[0077] The thermally conductive gel provided in this embodiment includes the following components by weight: 1000 parts by weight of diamond particles with a particle size of 1 μm, 50 parts by weight of alumina with a particle size of 1-25 μm, and 100 parts by weight of aluminum oxide with a particle size of 25-45 μm Parts, 50 parts by weight of alumina with a particle size of 45-90 μm, a thickness of 0.35-5 nm, and a high-aspect-ratio hexagonal boron nitride flake with an equivalent diameter of 130 nm-4 μm (the cross section is similar to a circle, and the aspect ratio is greater than 2:1) 50 parts by weight, 80 parts by weight of 300-viscosity hydroxyl silicone oil, 40 parts by weight of trimethoxysilane, 10 parts by weight of coupling agent aminopropyltrimethoxysilane and catalyst 1,2 propyldioxyethylene diacetoacetate ethyl titanium 2 parts by weight.

[0078]The preparation steps of the above-mentioned thermally conductive gel are:

[0079] (1) by the above parts by weig...

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Abstract

The invention relates to a high-thermal-conductivity composite gel, which is prepared from a gel base material, a heat-conducting filler and a coupling agent under the action of a catalyst. The heat-conducting filler is prepared from graphitized diamond particles and a heat-conducting auxiliary material, layered graphene grows on the surfaces of the graphitized diamond particles, and the heat-conducting auxiliary material is selected from at least one of aluminum oxide, zinc oxide, beryllium oxide and hexagonal boron nitride; the mass ratio of the gel base material to the heat-conducting filler is 1:9.5-15.2, the mass ratio of the heat-conducting filler to the coupling agent is 125-200:1, and the mass ratio of the graphitized diamond particles to the heat-conducting auxiliary material in the heat-conducting filler is 4-5:1. The invention further provides a preparation method of the high-thermal-conductivity composite gel.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and relates to a high thermal conductivity composite gel, in particular to a modified diamond-reinforced single-component condensation type thermal conductivity gel and a preparation method thereof. Background technique [0002] In 2020, 600,000 5G base stations will be built, and 180 million 5G mobile phones will be shipped. The development of 5G is accompanied by the high integration of electronic components in a limited space, so its heat dissipation problem is becoming more and more stringent. When electronic components are working under high load and high efficiency, if the heat cannot be effectively dissipated, its service performance will be greatly reduced, and even the electronic components will be directly damaged, which in turn will cause equipment damage and failure, affecting work, production efficiency and a large amount of manpower. Material loss. Effective heat dissipa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14B01J13/00
CPCB01J13/0052C09K5/14
Inventor 秦文波黄飞岳文陈昊王成彪
Owner 彗晶新材料科技(张家港)有限公司
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