Method and device for heat dissipation of server

Abstract

The invention discloses a server cooling method and device, which relate to the technical field of computers. A specific implementation of the method includes: obtaining the real-time temperature of the heating device, and adjusting the rotation speed or flow rate of the cooling system based on the temperature deviation between the real-time temperature and the expected temperature; when the real-time temperature feedback is abnormal, obtaining the real-time power consumption of the heating device, And adjust the rotation speed or flow rate of the heat dissipation system based on the power consumption deviation between the real-time power consumption and the expected power consumption; when the real-time power consumption feedback is abnormal, obtain the server inlet temperature and the motherboard inlet temperature, and adjust the heat dissipation based on the server inlet temperature or the motherboard inlet temperature The rotational speed or flow rate of the system. This embodiment regulates the heat dissipation system step by step, realizes on-demand adjustment of the heat dissipation system, avoids regulation misoperation, reduces the power and noise of the heat dissipation system, and saves electric energy.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a method and a device for dissipating heat from a server. Background technique [0002] Existing server designs mostly use fans or water cooling as cooling systems. [0003] The heat dissipation system can adjust the fan speed or water flow rate according to the temperature of each component, that is, the mode based on component PID (proportional-integral-derivative) control, the mode based on sensor linear control, or the above two parallel control modes. The mode based on component PID regulation is to regulate the fan speed or water flow rate based on the temperature of the component, and the mode based on sensor linear regulation is to regulate the fan speed or water flow rate based on the inlet air temperature. [0004] In the course of realizing the present invention, the inventor finds that there are at least the following problems in the prior art: [0005] 1. There m...

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Problems solved by technology

[0005] 1. There may be false alarms or failures when the component temperature is reported, and the real temperature status of the component cannot be accurately known only based on temperature control, which may easily cause control misoperation;

[0006] 2. Some components cannot feed back the temperature by themselves. For the heat dissipation of such components, the default full-load operation condition is usually used in the control strategy, so the fan speed or water flow rate will be set higher;

[0007] 3. The inlet air temperature is usually only one server inlet air temperature. Once abnormal, the usual practice is to run the fan or water flow at full speed directly, resulting in high power consumption and noise;

[0008] 4. If the above two control modes are used at the same time, the highest speed obtained from the two modes is used to set the fan speed or water flow rate. The fan speed or water flow rate will be too high, resulting in an increase in power and a waste of electric energy

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