Sensor assembly shell, leadless thermopile sensor and manufacturing method

Abstract

The invention provides a sensor assembly shell, a leadless thermopile sensor and a manufacturing method. The leadless thermopile sensor comprises the sensor assembly shell and a thermopile sensitive chip; the detection surface of the thermopile sensitive chip is correspondingly arranged below the top of the inner wall of the detection cavity of the sensor assembly shell; and an electrode bonding pad of at least one thermopile sensitive chip is in contact connection with an internal conductive convex block at the top of the detection cavity, so that the thermopile sensitive chip is electricallyconnected with the sensor assembly shell. According to the invention, the assembly process of the lead is reduced, the operation difficulty of the assembly process is greatly simplified, the assemblyefficiency is improved, and the technical problem of complex process of the existing thermopile sensor is solved; meanwhile, in terms of structural design, a lead binding space is omitted, the overall size of the leadless thermopile sensor is greatly reduced, and the problem that application of a thermopile sensor in the prior art is limited in electronic products due to the fact that the size ofthe thermopile sensor is too large is effectively solved.

Description

technical field [0001] The invention relates to the technical field of thermopile sensors, in particular to a sensor assembly shell, a leadless thermopile sensor and a manufacturing method. Background technique [0002] A thermopile sensor consists of multiple thermal elements combined into a thermoelectric array or thermopile. Thermopile sensors determine the physical temperature or gas concentration by monitoring the infrared radiation of an object. When the thermosensitive element receives the infrared radiation radiated by the object, there will be a heat difference between the hot end and the cold end of the thermosensitive element. Based on the Seebeck principle, the voltage output by the thermopile sensor will change. Entering the era of MEMS sensors, advanced semiconductor technology can process hundreds of pairs of thermocouples in a very small space to build infrared thermopile sensors. With MEMS technology, the size of infrared thermopile sensors has become very...

AI Technical Summary

Problems solved by technology

[0004] However, sensors with wire-bonded package structures are generally large in size, which is difficult to meet the application of thermopile sensors in small-sized electronic products such as earphones, mobile phones, and wearable devices.

[0005] Under the new crown epidemic, the detection accuracy of temperature measurement products and temperature measurement sensors is particularly important, but temperature measurement products made of thermopile sensors with wire-bonded packaging structures have technical problems of low detection accuracy and poor shock resistance; low detection accuracy It may lead to inaccurate body temperature parameters of some personnel, and the poor shock resistance of thermopile sensors may affect the service life of temperature measurement products, thereby hindering the progress of epidemic prevention work

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