The tin connection structure of the crystal oscillator test seat

Abstract

The invention discloses a tin-bonding connection structure of a crystal oscillator test station in the technical field of a crystal oscillator test station. One side of the test socket pins is provided with test card pads, and lap soldering tin is set between the test socket pins and the test card pads, and the test card pads are fixedly connected to the upper end face of the test card and close to the test socket mounting holes The test socket pins protrude from the test socket mounting holes, the number of test card pads and test socket mounting holes are the same, and they correspond one by one, and a second solder joint is provided between one end of the lap solder and the test card pads. Feet, test socket pin installation Wuxi via structure, adjacent connection test card pad structure, convenient test socket pin installation and fixation, when repairing and disassembling test socket pins, it is convenient to remove the connection point without damage, so as to quickly replace the test socket socket Needle, large contact surface, fast heat dissipation.

Description

technical field [0001] The invention relates to the technical field of a crystal oscillator test station, in particular to a tin-bonded connection structure of a crystal oscillator test station. Background technique [0002] As the heart of electronic equipment, the importance of crystal oscillator in equipment is self-evident; with the development of technology, crystal oscillator is gradually patched and miniaturized, which has higher requirements on the connection structure of test tooling. The test socket is installed on the test board mainly by directly soldering the test socket pins into the test card mounting holes. In this way, when the test socket needs to be repaired and replaced, the soldered pads need to be soldered one by one, the solder is removed, and then The test seat can only be removed, the operation is difficult, the pads are easily damaged, and the soldering tin is arranged in the installation hole of the test card, which also hinders the heat dissipatio...

AI Technical Summary

Problems solved by technology

[0002] As the heart of electronic equipment, the importance of crystal oscillators in equipment is self-evident; with the development of technology, crystal oscillators are gradually chipped and miniaturized, which has higher requirements for the connection structure of test tools. The test seat is installed on the test board by directly welding the test seat pins into the test card installation hole. When the test seat needs to be repaired and replaced in this way, it is necessary to absorb the welded pads one by one, remove the solder, and then The test seat can only be removed, the operation is difficult, the pad is easily damaged, and the soldering tin is arranged in the test card installation hole, which also hinders the heat dissipation effect of the device during use, and there are disadvantages in use. Based on this, the present invention designs a crystal oscillator test tool. The tin connection structure of the seat is used to solve the above problems

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