A light-emitting chip and a light-emitting module

Abstract

The invention provides a light-emitting chip, comprising a chip body, a first electrode connection end and a second electrode connection end, the chip body includes a first electrode layer and a second electrode layer insulated from each other, and the first electrode connection end and the second electrode connection end are arranged at the bottom of the chip body, the first electrode connection end is electrically connected to the first electrode layer, and the second electrode connection end is electrically connected to the second electrode layer connection; the first electrode connection end includes a first row connection end and a second row connection end electrically connected to each other, and the second electrode connection end includes a first column connection end and a second column connection end electrically connected to each other end. The light-emitting chip can be applied on a circuit board with a specific single-layer structure to assemble a light-emitting module with a specific structure. In addition, the invention also provides a lighting module.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a light-emitting chip and a light-emitting module. Background technique [0002] figure 1 A schematic structural diagram of a lighting module in the prior art is shown. For light-emitting modules, especially light-emitting modules applied to the field of backlight and display, the light-emitting chips 104 need to be arrayed on the circuit board 1. Correspondingly, corresponding to the electrode connections of the light-emitting chips 104, the circuit board 1 is provided with A plurality of row lines 106 and column lines 105 for electrical connection, the row lines 106 and column lines 105 are the positive and negative power supply lines of the light-emitting chip 104, and the two sides of the light-emitting chip 104 are driven by passive address selection. Each electrode needs to be electrically connected to the corresponding row line 106 and column line 105 to realize electrical conduction...

AI Technical Summary

Problems solved by technology

[0003] In specific processing, due to the process limitation of multi-layer structure circuit boards, the minimum thickness of circuit boards made of PCB materials can only reach 0.5mm. If the thickness of circuit boards needs to be less than 0.5mm, glass circuits can be made based on semiconductor manufacturing processes. However, the cost of glass circuit boards with multi-layer circuit layer structures based on semiconductor manufacturing processes is relatively high, and due to the multi-layer structure of circuit boards, there are still certain restrictions on the thickness of circuit boards.

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