Light-emitting chip and light-emitting module

Abstract

The invention provides a light-emitting chip. The chip comprises a chip main body, a first electrode connecting end and a second electrode connecting end, wherein the chip main body comprises a firstelectrode layer and a second electrode layer which are insulated from each other, the first electrode connecting end and the second electrode connecting end are arranged at the bottom of the chip mainbody, the first electrode connecting end is electrically connected to the first electrode layer, and the second electrode connecting end is electrically connected to the second electrode layer; the first electrode connecting end comprises a first row connecting end and a second row connecting end which are electrically connected to each other, and the second electrode connecting end comprises a first column connecting end and a second column connecting end which are electrically connected to each other. The light-emitting chip can be applied to a circuit board of a specific single-circuit layer structure to assemble a light-emitting module with a specific structure. In addition, the invention further provides a light-emitting module.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a light-emitting chip and a light-emitting module. Background technique [0002] figure 1 A schematic structural diagram of a lighting module in the prior art is shown. For light-emitting modules, especially light-emitting modules applied to the field of backlight and display, the light-emitting chips 104 need to be arrayed on the circuit board 1. Correspondingly, corresponding to the electrode connections of the light-emitting chips 104, the circuit board 1 is provided with A plurality of row lines 106 and column lines 105 for electrical connection, the row lines 106 and column lines 105 are the positive and negative power supply lines of the light-emitting chip 104, and the two sides of the light-emitting chip 104 are driven by passive address selection. Each electrode needs to be electrically connected to the corresponding row line 106 and column line 105 to realize electrical conduction...

AI Technical Summary

Problems solved by technology

[0003] In specific processing, due to the process limitation of multi-layer structure circuit boards, the minimum thickness of circuit boards made of PCB materials can only reach 0.5mm. If the thickness of circuit boards needs to be less than 0.5mm, glass circuits can be made based on semiconductor manufacturing processes. However, the cost of glass circuit boards with multi-layer circuit layer structures based on semiconductor manufacturing processes is relatively high, and due to the multi-layer structure of circuit boards, there are still certain restrictions on the thickness of circuit boards.

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