Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

MEMS piezoelectric piezoelectric sound pressure sensing chip based on elastic beam structures

An elastic beam, pressure sensing technology, applied in the direction of using electrical devices, electromagnetic means, vibration measurement in fluids, etc., can solve the problems of poor performance of MEMS sound pressure sensor chips, complex processing technology, large chip size, etc. Achieve the effect of improving acceleration sensitivity, increasing sensitivity, and increasing sensitivity

Active Publication Date: 2020-09-01
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the embodiment of the present invention provides a MEMS piezoelectric sound pressure sensor chip based on an elastic beam structure, aiming to solve the problem of poor performance of the MEMS sound pressure sensor chip in the prior art, and the processing technology is complicated, the chip Larger Issues

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MEMS piezoelectric piezoelectric sound pressure sensing chip based on elastic beam structures
  • MEMS piezoelectric piezoelectric sound pressure sensing chip based on elastic beam structures
  • MEMS piezoelectric piezoelectric sound pressure sensing chip based on elastic beam structures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0042] In order to illustrate the technical solutions of the present invention, specific examples are used below to illustrate.

[0043] figure 1 The structural schematic diagram of the MEMS piezoelectric acoustic pressure sensor chip based on the elastic beam structure provided by the embodiment of the present invention is described in detail as follows.

[0044] see Figure 1 to Figure 3 , a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention is applicable to the technical field of hydrophones, and provides an MEMS piezoelectric piezoelectric sound pressure sensing chip based on elastic beam structures. The chip comprises a first substrate and a second substrate which are in bonding connection; the bonding surface of the first substrate is provided with a groove, and the groove and the bonding surface of the second substrate form a vacuum cavity. An induction structure is arranged at the position, corresponding to the groove, of the second surface of the second substrate, and the second surface of the second substrateis the surface corresponding to the bonding surface; and a plurality of elastic beam structures are arranged around an area corresponding to the induction structure on the bonding surface of the second substrate, the plurality of elastic beam structures are arranged at the top of the vacuum cavity, and the edge positions of the plurality of elastic beam structures correspond to the edge positionof the vacuum cavity. By arranging the plurality of elastic beam structures, the performance of the MEMS sound pressure sensing chip can be improved, the processing technology is simplified, and the size of the chip is reduced.

Description

technical field [0001] The invention belongs to the technical field of hydrophones, in particular to a MEMS piezoelectric sound pressure sensor chip based on an elastic beam structure. Background technique [0002] A hydrophone is a device based on the principle of hydroacoustics that can measure the sound field in a fluid. The hydrophone can be a device packaged with a MEMS sound pressure sensing chip. Sound waves propagate in water in the form of longitudinal waves, and sound pressure is generated during the propagation process. When the hydrophone outputs the induced voltage signal, when the sound wave propagates to the MEMS miniature hydrophone, the sound pressure first interacts with the packaging structure of the hydrophone. Function, because the packaging structure of the hydrophone is a sound-transparent design, the sound pressure can pass through almost without loss, and the sound pressure through the packaging structure acts on the MEMS sound pressure sensor chip,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01H3/12G01H11/08
CPCG01H3/125G01H11/08
Inventor 钱丽勋李宏军解涛王胜福杨志郭松林孙从科徐佳梁东升丁现朋于江涛周名齐周少波袁柯李理
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com