Wafer conveying equipment, chemical mechanical planarization device and wafer conveying method

Abstract

The invention discloses wafer conveying equipment, a chemical mechanical planarization device and a wafer conveying method. The wafer conveying equipment comprises a manipulator for clamping and carrying wafers and a transfer table for placing the wafers, wherein the manipulator comprises a first clamping claw, a second clamping claw, a lifting table, a moving mechanism, a rotating mechanism and acontrol mechanism, and the transfer table comprises a first transfer table body, a second transfer table body and a mounting frame. According to the wafer conveying equipment, the chemical mechanicalplanarization device and the wafer conveying method, in the conveying process, dry and wet separation can be achieved, liquid such as polishing liquid carried by polished wafers is prevented from polluting clean wafers, and the yield of the wafers can be increased; and besides, in the wafer conveying process, the first clamping claw and the second clamping claw can clamp or loosen the wafers at the same time, one clamping claw can clamp one wafer, and the other clamping claw can loosen another wafer at the same time, so that the process that a single clamping claw frequently moves is avoided,and the wafer conveying efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit chip manufacturing, and more specifically relates to a wafer transfer device. In addition, the present invention also relates to a chemical mechanical planarization device including the above-mentioned wafer transmission equipment and a wafer transmission method suitable for the above-mentioned wafer transmission equipment. Background technique [0002] CMP planarization equipment generally includes a semiconductor equipment front-end module (EFEM), a cleaning unit, and a polishing unit. In an existing chemical mechanical polishing and planarization device, the wafer transfer between the polishing area and other areas is realized through a wafer exchange mechanism and a manipulator. The wafer exchange mechanism mainly cooperates with the manipulator to complete the sending and receiving of wafers, and plays a bridge role between the peripheral equipment and the core part ...

AI Technical Summary

Problems solved by technology

[0003] The existing wet environment manipulator can only carry one wafer at a time. The action of taking out the polished wafer and putting in the wafer to be polished needs to be completed in two steps. The wafer exchange mechanism can only place one wafer at a time, and cannot simultaneously Carry out the work of sending or taking the wafer in the polishing area; make the transfer time of the wafer longer and the transfer efficiency lower

And when the wafer passes through the polishing unit, the polishing liquid is attached to the surface of the wafer. If the time for transferring the wafer to the cleaning unit is too long, the polishing liquid will dry and adhere to the wafer, which will affect the quality and yield of the wafer.

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