Efficient automatic soldering process for patch common-mode inductors

Abstract

The invention discloses an efficient automatic soldering process for patch common-mode inductors. The process comprises the following steps that (1) patch common-mode inductors are placed on a jig strip at interval, wherein the upper surface of the jig strip is provided with limiting protrusions inserted into the patch common-mode inductors for positioning and adsorption magnetic blocks located onthe two sides of the limiting protrusions and adsorbing the patch common-mode inductor; (2) the jig strip is biased to a set angle, so that the surface of the welding feet PIN on one sides of the patch common-mode inductors is exposed upwards; (3) flux spraying is performed on the exposed surfaces of the welding feet PIN on the side by using precision spraying equipment; (4) the step 2 and the step 3 are repeated, flux spraying of the welding feet PIN on the other side is completed, and then the jig strip is restored to an initial state; (5) hot air is blown; (6) selective wave crest weldingis carried out; (7) cleaning is carried out; and (8) CCD detection is carried out. According to the process, automatic soldering operation can be realized, the soldering efficiency, the soldering precision and the soldering effect are greatly improved.

Description

【Technical field】 [0001] The invention belongs to the technical field of soldering process for inductance elements, in particular to a high-efficiency automatic soldering process for patch common-mode inductors. 【Background technique】 [0002] SMD common mode inductor ACM has the characteristics of small footprint on the circuit board, convenient mass processing and production, and high wiring density. It is widely used in switching power supplies, automotive electronics, security fields, consumer electronics, communication equipment, industrial control and other industries. [0003] During the production process of the chip common mode inductor ACM, the pins on both sides of the chip need to be dipped and soldered. Before welding, a layer of flux needs to be applied, and the pins of the chip common mode inductor ACM are exposed Both the upper surface and the side surface need to be coated with flux. Because the distance between the ACM solder PIN and the coil of the chip c...

AI Technical Summary

Problems solved by technology

Because the distance between the ACM solder PIN and the coil of the chip common mode inductor is very close, using the traditional manual electric soldering iron soldering process will cause fatal problems such as coil melting, tin tip, patch surface melting tin, false soldering, and uneven solder filling. Satisfy the solder quality requirements, other solder processes cannot solve the above problems

At present, the production process adopts manual brushing of flux, manual electric soldering iron soldering, and manual inspection process. The disadvantages are that the efficiency of manual soldering is low, the quality is unstable, and the efficiency of manual inspection is low.

[0004] High solder quality has strict requirements on the amount of flux. Traditional methods such as dipping, dipping, and brushing cannot guarantee quantitative control of flux. The current production process adopts artificial brush coating process, which has high defect rate, low efficiency, and poor soldering effect. good

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