FPC steel sheet reinforcement optimization method, FPC board steel sheet reinforcement structure and electronic equipment

An optimization method and reinforcement structure technology, applied to the reinforcement of printed circuits, electrical components, conductive patterns, etc., can solve the problems of large grounding impedance, unfavorable conduction, and high cost of steel sheets, and achieve small grounding impedance, which is conducive to conduction, Reduce the effect of using

Pending Publication Date: 2020-08-21
成都大超科技有限公司
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Problems solved by technology

[0003] However, in the prior art, when the FPC board is generally reinforced with a steel plate, it is generally bonded with a conductive adhesive, which leads to an excessively large grounding impedance of the steel sheet after interconnection, which is not conducive to conduction and its cost is high

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  • FPC steel sheet reinforcement optimization method, FPC board steel sheet reinforcement structure and electronic equipment
  • FPC steel sheet reinforcement optimization method, FPC board steel sheet reinforcement structure and electronic equipment
  • FPC steel sheet reinforcement optimization method, FPC board steel sheet reinforcement structure and electronic equipment

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[0035] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0036] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

[0037] see figure 1 , the first embodiment of the present invention provides a kind of FPC steel sheet re...

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Abstract

The invention relates to the technical field of circuit boards, in particular to an FPC (Flexible Printed Circuit) steel sheet reinforcement optimization method. An FPC board and a steel sheet are included. The method comprises the following steps of S1, respectively forming via holes in the FPC board or the steel sheet; S2, arranging an activation layer on one surface of the steel sheet; S3, arranging an adhesive layer on the activation layer, and attaching the FPC board to the steel sheet; S4, carrying out surface cleaning on the via hole after lamination; and S5, arranging a soldering tin material on the via hole and carrying out curing treatment to realize soldering tin interconnection of the FPC board and the steel sheet. The invention also provides an FPC board steel sheet reinforcing structure. The invention provides the FPC steel sheet reinforcement optimization method and the FPC board steel sheet reinforcement structure. The FPC steel sheet reinforcing effect is achieved, theactivation layer is arranged on the steel sheet, and the surface is cleaned before tin soldering, so that the steel sheet and the FPC board can be conducted through tin soldering, the grounding impedance performance is improved, and the cost is greatly reduced.

Description

【Technical field】 [0001] The invention relates to the technical field of circuit boards, in particular to an FPC steel sheet reinforcement optimization method, an FPC sheet steel sheet reinforcement structure, and electronic equipment. 【Background technique】 [0002] Flexible printed circuit board (Flexible Printed Circuit Board; referred to as FPC board) is a printed circuit made of flexible substrates, which can be freely bent, wound, folded, and arranged arbitrarily according to the spatial layout. It is often used as a circuit carrier for electronic products. It reduces the size of electronic products during the assembly process and adapts to the high-density requirements of circuit components of electronic products. Therefore, FPC boards are widely used in mobile communications, computers, digital cameras, and even aerospace and military fields. [0003] However, in the prior art, when the FPC board is generally reinforced with a steel plate, it is generally bonded with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/26H05K3/24
CPCH05K1/181H05K3/26H05K3/24
Inventor 张千向勇
Owner 成都大超科技有限公司
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