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Water-cooling and air-cooling combined computer mainframe box and using method thereof

A computer and main box technology, applied in the field of water-cooled and air-cooled computer main box, can solve the problems of low heat dissipation efficiency of the computer case and ineffective combination of heat dissipation methods, so as to increase the air-cooled heat dissipation efficiency and avoid the damage of extra power Effect

Active Publication Date: 2020-07-28
LULIANG UNIV
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a water-cooled and air-cooled computer mainframe and its use method in view of the deficiencies of the above-mentioned prior art, so as to solve the problem of low heat dissipation efficiency and ineffective heat dissipation methods of the computer chassis proposed in the above-mentioned background technology. combined problem

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  • Water-cooling and air-cooling combined computer mainframe box and using method thereof
  • Water-cooling and air-cooling combined computer mainframe box and using method thereof
  • Water-cooling and air-cooling combined computer mainframe box and using method thereof

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[0035] In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0036] Many specific details are set forth in the following description to facilitate a full understanding of the present invention, and the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] In the description of the present invention, it should also be noted that, unless otherwise clearly specified and lim...

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Abstract

The invention discloses a water-cooling and air-cooling combined computer mainframe box. The box comprises a box body, wherein an opening is formed in the side surface of the box body; a component mounting frame fixed on the inner side of the box body; wherein air cooling mechanisms are arranged on the two sides of the box body. The air cooling mechanism comprises a first fan, a second fan and a third fan; a water cooling mechanism is also arranged in the box body; the water-cooling mechanism comprises a water tank, a circulating pump, a three-way pipe, a control valve, a water inlet pipe, a water-cooling head and a water outlet pipe; the air cooling mechanism further comprises a temperature sensor and a control module. The signal input end of the control module is in signal connection with the temperature sensor; the signal output end of the control module is in signal connection with the fan switch, the pump switch and the control valve. By arranging the three fans, the fans work independently and cooperate with the water cooling mechanism through the control module, so that extra power loss is reduced during heat dissipation, and the heat dissipation device is economical and practical.

Description

technical field [0001] The invention relates to the technical field of computer mainframes, in particular to a water-cooled and air-cooled computer mainframe and a method for using the same. Background technique [0002] The computer mainframe box is also called the chassis. As a part of the computer accessories, the main function of the chassis is to place and fix various computer accessories, and play a supporting and protective role. In addition, the chassis has an important role in shielding electromagnetic radiation. The chassis is not like CPU, graphics card, motherboard and other accessories that can quickly improve the performance of the whole machine, so the form is also various, but the heat dissipation and dust resistance of the chassis are relatively important considerations in the process of use. Computers usually have two heat dissipation methods, air-cooled and water-cooled, to complete their efficient heat dissipation. [0003] However, the combination of ai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20Y02D10/00
Inventor 乔丽
Owner LULIANG UNIV
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