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Curing agent and urea resin composition containing same

A technology of urea-formaldehyde resin and curing agent, which is applied in the direction of adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problems of energy consumption, long resin curing time, and large formaldehyde content, etc. High latency and high curing activity

Active Publication Date: 2020-07-24
HANGZHOU LINAN DIEN CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, urea-formaldehyde resin releases a large amount of formaldehyde during use, which is easy to pollute the environment, so it is necessary to modify the urea-formaldehyde resin
Reducing the F / U molar ratio of the resin is a more effective way to reduce the release of free formaldehyde. However, due to the long curing time of urea-formaldehyde resins with low molar ratios, there is a problem that urea-formaldehyde resins consume a lot of energy in industrial production. Therefore, a It is particularly important to find a suitable curing agent to solve the problem of long curing time of the resin

Method used

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preparation example Construction

[0038] The second aspect of the present invention provides a preparation method according to the curing agent, which at least includes the following steps: adding each component into a stirring tank and stirring evenly.

[0039] In a preferred embodiment, the preparation method of the curing agent at least includes the following steps: firstly add the solvent into the stirring tank, then add the amino acid salt and stir until it is completely dissolved, then add the nitrogen heterocyclic compound and stir until it is completely dissolved , out of the box.

[0040] The third aspect of the present invention provides a urea-formaldehyde resin composition, including a urea-formaldehyde resin prepolymer and the curing agent.

[0041] In a preferred embodiment, the mass ratio of the urea-formaldehyde resin prepolymer and curing agent is 100:(0.1~4); more preferably, the mass ratio of the urea-formaldehyde resin prepolymer and curing agent is 100 : (2-4); more preferably, the mass r...

Embodiment 1

[0046] Embodiment 1 of the present invention provides a curing agent, the preparation raw material is a nitrogen-containing compound and a solvent; the mass ratio of the nitrogen-containing compound and the solvent is 2:3

[0047]The nitrogen-containing compound includes amino acid salt and nitrogen heterocyclic compound; the mass ratio of the amino acid salt and nitrogen heterocyclic compound is 3:1.

[0048] The amino acid salt is L-lysine hydrochloride, purchased from Zhengzhou Yuhe Food Additive Co., Ltd.

[0049] The nitrogen heterocyclic compound is hexamethylenetetramine.

[0050] The solvent is deionized water.

[0051] The preparation steps of the curing agent are as follows: firstly add the solvent into the stirring tank, then add the amino acid salt and stir until completely dissolved, then add the nitrogen heterocyclic compound and stir until completely dissolved, and then discharge the product.

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Abstract

The invention relates to the technical field of curing agents, particularly provides a curing agent and a urea-formaldehyde resin composition containing the same. The curing agent is prepared from atleast a nitrogen-containing compound and a solvent, wherein the mass ratio of the nitrogen-containing compound to the solvent is (1.5-2.5):3.

Description

technical field [0001] The invention relates to the technical field of curing agents, more specifically, the invention provides a curing agent and a urea-formaldehyde resin composition containing the curing agent. Background technique [0002] Urea-formaldehyde resin (urea-formaldehyde resin, referred to as UF) is a synthetic resin formed by addition and polycondensation of formaldehyde and urea under certain conditions. Attention, its demand is also rising. In order to quickly and evenly apply glue and prevent defects such as bubbling and delamination of the board, the current high-temperature and high-speed pipeline airflow method is generally used in the production of medium density fiberboard to dry the glued fibers. After cleaning, hot grinding and dehydration, the measured pH value of the fiber is below 5.0, which is acidic. Therefore, once the sized fiber is exposed to the high temperature and high humidity conditions of the drying pipeline, part of the resin will in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J11/06C09J161/24
CPCC09J11/06C09J161/24C08K5/175C08K5/3492
Inventor 奚佳勇
Owner HANGZHOU LINAN DIEN CHEM CO LTD
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