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Assembling method for rotating target material

An assembly method and a technology of rotating targets, which are applied in auxiliary devices, metal material coating technology, ion implantation plating, etc., can solve problems such as difficulty in realization, complicated welding process, and low welding pass rate, and achieve uniform splicing gaps and smooth welding The effect of high bonding rate and high yield

Active Publication Date: 2020-07-14
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The assembly method provided by the invention can solve the problems of low welding pass rate, complicated welding process and difficult realization of the rotating target in the subsequent welding process

Method used

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  • Assembling method for rotating target material
  • Assembling method for rotating target material
  • Assembling method for rotating target material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] In this embodiment, the assembly of the rotating target is carried out according to the following method:

[0069] First, the rotating target 1 (AZO ceramic tube) to be spliced ​​is heated and soaked at 220°C for 40 minutes with indium solder (accompanied by ultrasonic treatment of the surface), and the back tube 2 (stainless steel back tube) is heated and soaked with indium solder at 220°C for 50 minutes. (with ultrasonic treatment of the surface), followed by splicing.

[0070] Press the back tube 2 and the 4 rotating targets 1 into the figure 1 As shown in the splicing, the rotating target 1 is set on the back tube 2, and the back tube 2 is vertically placed on the base 3. The splicing gap is separated by the first support 4 (0.8mm copper wire). The first support The shape of 4 is U-shaped, and the U-shaped arc part is bent and tilted, as shown in Figure 2(a), the first support 4 is completely retained in the upper and lower sections of the rotating target 1, and th...

Embodiment 2

[0075] In this embodiment, the assembly of the rotating target is carried out according to the following method:

[0076] First, the rotating target (AZO ceramic tube) to be spliced ​​is heated and soaked with indium solder at 210°C for 50 minutes (with ultrasonic treatment of the surface), and the back tube (stainless steel back tube) is heated and soaked with indium solder for 55 minutes at 210°C (with ultrasonic treatment of the surface). with ultrasonically treated surface), followed by splicing.

[0077] The back tube and three rotating targets are spliced, the rotating target is set on the back tube, the back tube is placed vertically on the base, and the splicing gap is separated by the first support (0.6mm copper wire). The shape of the support is U-shaped, and the U-shaped arc part is bent and tilted, and the first support is completely retained in the upper and lower sections of the rotating target, and the U-shaped first support is bent and tilted. It is located be...

Embodiment 3

[0082] In this embodiment, the assembly of the rotating target is carried out according to the following method:

[0083] First, the rotating target (AZO ceramic tube) to be spliced ​​is heated and soaked with indium solder at 240°C for 35 minutes (with ultrasonic treatment of the surface), and the back tube (stainless steel back tube) is heated and soaked with indium solder at 240°C for 40 minutes (with ultrasonic treatment surface). with ultrasonically treated surface), followed by splicing.

[0084] Splice the back tube and 6 rotating targets. The rotating target is placed on the back tube. The back tube is placed vertically on the base. The splicing gap is separated by the first support (1mm copper wire). The first support The shape of the piece is U-shaped, and the curved part of the U-shaped part is bent and tilted, and the first support part is all kept in the upper and lower sections of the rotating target, and the curved part of the U-shaped first support part is loca...

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Abstract

The invention provides an assembling method for a rotating target material. The method comprises the steps that at least two rotating target material bodies are arranged on a back pipe in a sleeving mode to be spliced, a splicing gap is formed between every two adjacent rotating target material bodies, and multiple first supporting pieces are arranged in each splicing gap; one part of each first supporting piece is located between the rotating target material body on one side of the splicing gap and the back pipe, and the other part of each first supporting piece is located between the rotating target material body on the other side of the splicing gap and the back pipe; a second supporting piece is arranged in each splicing gap, the second supporting pieces are annular and arranged on theback pipe in a sleeving mode so as to separate the two rotating target material bodies forming the rotating target material; and each splicing gap is sealed through a sealing piece so as to obtain the assembled rotating target material. According to the assembling method for the rotating target material, the obtained assembled rotating target material is high in welding bonding rate, high in finished product rate and uniform in splicing gap during welding, the surface height consistency of the adjacent rotating target material bodies is good, and no step exists on surfaces.

Description

technical field [0001] The invention belongs to the technical field of target assembly and relates to an assembly method for a rotating target. Background technique [0002] Transparent conductive oxide films have good light transmittance and good electrical conductivity in the visible light region, and are widely used in liquid crystal display coatings, photovoltaic solar coatings, and large-area glass coatings. The thin film is usually prepared by magnetron sputtering. The principle is to bombard the surface of the target with particles of a certain energy, so that solid atoms or molecules are separated from the surface and deposited on the surface of the substrate or workpiece to form a thin film; the thin film prepared by this method is compatible with the substrate. Strong adhesion, high uniformity of film density. [0003] Tin-doped indium oxide (ITO) thin film is the first generation of transparent conductive oxide thin film material, which is widely used in optical ...

Claims

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Application Information

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IPC IPC(8): B23K31/02B23K37/00C23C14/35
CPCB23K31/02B23K37/00C23C14/3407
Inventor 姚力军潘杰边逸军王学泽祝龙飞
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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