Die cutting device for miniaturized foam product

Abstract

The invention relates to a die cutting device for a miniaturized foam product. The foam product comprises a release film layer, a double-sided adhesive tape layer and a foam layer which are sequentially adhered together from bottom to top, the length of the foam layer is greater than that of the double-sided adhesive tape layer, and the die cutting device comprises a composite material belt feeding unit, a double-sided adhesive tape die cutting unit, a double-sided adhesive tape waste discharge unit, a foam feeding unit, a foam die cutting unit and a foam waste discharge unit which are sequentially arranged along the moving direction of a material belt. Compared with the prior art, a whole adhesive area is die-cut on the double-sided adhesive tape layer by using a double-sided adhesive tape die cutter, the problems of displacement, adhesive overflow and the like of double-sided adhesive tape are avoided, the outer contour of the foam product is die-cut on the foam layer by using a foamdie cutter, and a product adhesive area and a double-sided adhesive tape waste area in the whole adhesive area are simultaneously cut apart, so that the processing steps are simplified, smooth die-cutting processing of the foam product is realized, problems of adhesive overflow, difficulty in waste discharge, product falling and the like are avoided, and product quality is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of foam product processing and relates to a die-cutting device for miniaturized foam products. Background technique [0002] In the past, the processing of foam products often used a one-time punching process. Using a die-cutting machine to perform one punching, the foam product can be quickly and accurately die-cut on the material belt. This one-step punching The foam process has the advantages of high output and no offset between foam and glue. [0003] With the continuous development of science and technology, electronic products are gradually thinner and smaller, and the corresponding die-cutting products for electronic products are also becoming smaller and smaller, and the technical requirements for the die-cutting industry are also getting higher and higher. At present, when more and more miniaturized foam products are processed by the traditional one-step punching process, there are problems such as...

AI Technical Summary

Problems solved by technology

At present, when more and more miniaturized foam products are processed by the traditional one-step punching process, there are problems such as overflow of glue, difficulty in waste discharge, and many product drops, which cause many problems for subsequent processing and application. , and lead to direct economic losses

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