Lens coupling equipment for multi-channel single-mode cob modules

A technology for coupling equipment and lenses, applied in the coupling, instrumentation, installation and other directions of optical waveguides, can solve the problems affecting the packaging quality of COB modules, difficult to meet the requirements of COB module packaging process, etc., to improve the feeding efficiency and the clamping force. Adjust and control simple effects

Active Publication Date: 2021-05-04
CENT SOUTH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the accuracy of lens coupling and the quality of dispensing and curing significantly affect the packaging quality of COB modules
At the same time, there are many packaging positions for the lens on the PCB, and the lens is a small micro-lens, which makes the storage, loading and coupling process of the lens more sophisticated and complicated, and it is difficult to meet the above-mentioned COB module packaging with conventional equipment. Process requirements

Method used

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  • Lens coupling equipment for multi-channel single-mode cob modules
  • Lens coupling equipment for multi-channel single-mode cob modules
  • Lens coupling equipment for multi-channel single-mode cob modules

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Embodiment Construction

[0033] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments. Apparently, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

[0034] refer to Image 6 , in this embodiment the lens 1 is composed of a square portion 1a and a mirror portion 1b convex from the square portion 1a toward both sides in the thickness direction. Such as figure 1 As shown, the lens coupling device for mul...

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Abstract

The invention provides a lens coupling device for multi-channel single-mode COB modules, including a lens feeding assembly, a lens fixture assembly, a PCB clamping assembly, a dispensing module, a curing module and a visual detection module; Multiple lenses are installed, and the lenses are loaded sequentially. The lens fixture assembly clamps and moves the lens loaded by the lens loading assembly to the corresponding packaging position on the PCB, and couples with the light-emitting element and the receiving element on the PCB. The PCB is fixed by the PCB. The clamping component is clamped and fixed, the dispensing module dispenses glue to the coupled lens, the curing module cures the dispensed lens, and the visual inspection module is used for visual inspection of the lens feeding and coupling process. The lens of the present invention adopts the method of automatic feeding, and is successively clamped to the surface of the PCB board by the lens clamping components, and is automatically coupled, glued and cured one by one. efficiency, precision and package quality.

Description

technical field [0001] The invention relates to the technical field of COB, in particular to a lens coupling device for a multi-channel single-mode COB module. Background technique [0002] COB (Chip-on-Board), also known as direct chip mounting technology, refers to the method of directly pasting bare chips on the printed circuit board PCB, then performing wire bonding, and then using organic glue to protect the chip and leads. craft. Compared with the traditional process, COB has the following advantages: eliminates the requirement for wire bonding connection, increases the connection density, and makes the product performance more stable and reliable; eliminates the link pins between the chip and the application circuit board, and improves the product reliability. Integration; it can be bonded and mounted on both sides of the PCB, correspondingly reducing the size of the application module and expanding the application space of the COB module; stronger ease of use, more ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42G02B7/02
CPCG02B6/4239G02B6/4251G02B6/4204G02B6/4287G02B6/428G02B7/025
Inventor 段吉安唐佳卢胜强徐聪
Owner CENT SOUTH UNIV
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