Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cylinder and the machine including the cylinder

A technology of cylinders and machines, applied in the direction of fluid pressure actuation devices, etc., can solve problems such as dropping, lowering processing quality, and not closing the door tightly

Active Publication Date: 2022-04-01
NINGBO SEMICON INT CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the door between the transfer chamber and the etching chamber is often not closed tightly, causing the dry etching machine to stop or stop production
Not only that, the wafer is also prone to shaking, falling, etc., and even more by-products (usually polymer) are deposited on its surface, which increases the defect rate of the wafer and reduces the processing quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cylinder and the machine including the cylinder
  • Cylinder and the machine including the cylinder
  • Cylinder and the machine including the cylinder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] As mentioned in the background technology, the inventors found that the door between the transfer chamber and the etching chamber of the dry etching machine is often not closed tightly, and the wafer is also prone to shaking, falling, etc., and the surface of the wafer is also prone to deposit side effects product. The inventor further researched and found that because the cylinder is a single cylinder and is easily damaged, the door is often not closed tightly, causing the machine to stop frequently or stop production, reducing production efficiency. In addition, based on the reason that the cylinder is easy to vibrate during the working process, the wafer bounces and even falls. Sometimes the vibration of the cylinder can easily cause the by-products on the etching cavity wall to loosen and fall on the surface of the wafer during the etching process, causing Wafer surface defects.

[0049] In order to solve the problem that the single cylinder is easily damaged, the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a cylinder and a machine including the cylinder. The cylinder includes: a cylinder body, a piston rod and a piston, the piston rod passes through the axial end of the cylinder body, and the piston is movably arranged inside the cylinder body and connected with the piston rod; the cylinder body includes: inner and outer cylinder bodies , the outer cylinder is fixedly sleeved outside the inner cylinder and sealed with it, and an outer chamber is formed between the inner and outer cylinders; the piston includes inner and outer piston bodies, the inner piston body is located in the inner cylinder, and the outer The piston body is located in the outer chamber and is used to move synchronously with the inner piston body; the first and second holes communicating with the outer chamber and the inner cylinder body are opened on the side wall of the inner cylinder body; The third and fourth holes communicated with the outer chamber and the outside; and the first and third holes are located on one side of the piston, and the second and fourth holes are located on the other side of the piston; such a structure can improve the cylinder service life, the preferred piston rod is only one, to simplify the structure of the cylinder.

Description

technical field [0001] The invention relates to the technical field of cylinders, in particular to a cylinder and a machine including the cylinder. Background technique [0002] Wafer (wafer) is the basic material for manufacturing semiconductor chips. During its manufacturing process, it is inevitable to undergo an etching process. [0003] The etching process is usually carried out on an etching machine, and a dry etching machine is commonly used. The dry etching machine is equipped with a transfer chamber and an etching chamber, and the wafer is sent into the etching chamber through the transfer chamber to perform the etching process. During etching, in order to avoid contamination and pressure disturbance between the chambers, an openable door is provided between the transfer chamber and the etching chamber. In addition, the dry etching machine is also equipped with a lifting device, which drives multiple thimbles through the electrostatic chuck, so as to lift the wafe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F15B15/14F15B15/22
CPCF15B15/1404F15B15/1414F15B15/1423F15B15/1428F15B15/149F15B15/1447F15B15/223
Inventor 刘超群孙超李晓王昭龙
Owner NINGBO SEMICON INT CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products