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Sparse reconstruction method for micro-defect high-frequency ultrasonic microscopic imaging based on blind estimation

A technology of microscopic imaging and sparse reconstruction, which is applied in the field of image processing, can solve the problems of gap, sparse reconstruction of echo signals, limited processing equipment time, poor applicability, etc., to improve accuracy and efficiency, and improve applicability and practicality, enhancing the effect of image signal-to-noise ratio and resolution

Inactive Publication Date: 2020-06-26
JIANGNAN UNIV
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Problems solved by technology

[0003] At present, most of the research on ultrasonic microscopic imaging is focused on the super-resolution reconstruction technology of ultrasonic echo signals, identifying the position and size features contained in the signals, and achieving better processing results, but the echo The method of sparse reconstruction of the signal is limited by the processing equipment and the time required to process the data
At present, the reconstruction of two-dimensional ultrasonic images mainly uses simulation methods to obtain the point spread function of high-frequency ultrasonic probes, but this method needs to set different simulation models for different high-frequency ultrasonic probes, and its applicability is poor. , and there is a gap between the point spread function obtained by the simulation and the point spread function of the actual probe

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  • Sparse reconstruction method for micro-defect high-frequency ultrasonic microscopic imaging based on blind estimation
  • Sparse reconstruction method for micro-defect high-frequency ultrasonic microscopic imaging based on blind estimation
  • Sparse reconstruction method for micro-defect high-frequency ultrasonic microscopic imaging based on blind estimation

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Embodiment Construction

[0052] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0053] This application discloses a sparse reconstruction method for high-frequency ultrasonic microscopic imaging of small defects based on blind estimation. Please refer to figure 1 , the method includes the following steps:

[0054] Step 1: Use an ultrasonic microscopic imaging system (SAM, D9500, Sonoscan, Elk Grove Village, IL, USA) to obtain the original C-scan image of the sample to be tested, the sampling step size s is 1 μm, and the ultrasonic probe frequency is 230 MHz (230SP probe ). The point spread function of the ultrasonic probe of the ultrasonic microscopic imaging system does not change with the change of the space-time position of the measured object, and the ultrasonic probe is a high-frequency focused ultrasonic probe with a frequency of 100 MHz or above. figure 2 is the original C-scan image constructed according to t...

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Abstract

The invention discloses a sparse reconstruction method for micro defect high-frequency ultrasonic microscopic imaging based on blind estimation and relates to the technical field of image processing,the method comprises the following steps: 1, ; acquiring a C scanning image of the sample to be detected by using a high-frequency ultrasonic microscopic probe; and denoising the C-scan image throughblock clustering and collaborative filtering, estimating a point spread function from the denoised C-scan image according to the maximum posteriori probability, and finally performing sparse reconstruction on the ideal C-scan image based on l1 regularization to obtain a final high-resolution image. According to the method, the signal-to-noise ratio and the resolution of the image are enhanced, thedetection accuracy of acoustic microscopy imaging on tiny defects is improved, the practicability of the two-dimensional ultrasonic image sparse reconstruction method is expanded. Meanwhile, the method has very important significance on detection of microdefects, and the development of the reliability of micro devices can be effectively promoted.

Description

technical field [0001] The invention relates to the technical field of image processing, in particular to a sparse reconstruction method for high-frequency ultrasonic microscopic imaging of small defects based on blind estimation. Background technique [0002] With the advancement of technologies such as micro-manufacturing and micro-systems and the rapid development of related industries, the trend of miniaturization of products is accelerating. Micro-manufacturing technology with high performance and high reliability has received more and more attention, and its application widely. For a microsystem, the overall size of its components is generally on the order of centimeters or millimeters. Compared with the overall size of a microsystem, the size of its internal defects is smaller. The most commonly used methods for micro-defect detection mainly include Acoustic Micro Imaging (AMI), infrared thermal imaging, and X-ray detection. micron scale. This completely covers the...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T3/40G06T5/00G06K9/62G06F17/16
CPCG06T3/4053G06F17/16G06T2207/10132G06T2207/20056G06F18/23G06T5/70
Inventor 余晓男宿磊李可顾杰斐黄海润
Owner JIANGNAN UNIV
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