Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

High heat insulation flip type pcb module

A PCB board and page-turning technology, which is applied to printed circuit components, stacked and separated printed circuit boards, cooling/ventilation/heating transformation, etc., can solve problems such as large space occupation, poor heat insulation effect of PCB boards, and difficult maintenance , to achieve the effect of reducing heat conduction speed, reducing contact area, taking out and inserting easily

Active Publication Date: 2021-06-04
深圳市江霖电子科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of technology, people have given more and more functions to PCB boards. As the design of PCB boards becomes more and more complex, in order to standardize the design, a modular layout of one or more PCB boards has appeared. There are a lot of PCB boards in the equipment. If it is installed in layers, it will be difficult to maintain later and the heat insulation effect between adjacent PCB boards is poor. If it is installed in tiles, it will take up a lot of space.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High heat insulation flip type pcb module
  • High heat insulation flip type pcb module
  • High heat insulation flip type pcb module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to make the technical problems, technical solutions and beneficial effects solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0024] Such as Figure 1 to Figure 3 As shown, the embodiment of the present application proposes a high heat insulation page-turning PCB module, including a support 1 and a plurality of PCB boards 100, and the support 1 is provided with at least two upwardly arched arched guide rods 2, A plurality of PCB boards 100 are slidably sleeved on the arched guide rod 2, two adjacent PCB boards 100 are stacked, and each PCB board 100 can move from the arched guide rod 2 along the arched guide rod 2. One side of the shaped guide rod 2 slides to the oppos...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present application relates to the field of PCB technology, in particular to a high thermal insulation page-turning PCB module, which includes a plurality of PCB boards and a support. Each of the PCB boards is slidably sleeved on the arched guide rod, two adjacent PCB boards are stacked and placed, and each PCB board can slide along the arched guide rod from one side of the arched guide rod to the opposite side; a plurality of downwardly protruding legs are evenly arranged around the PCB board to form a gap between two adjacent PCB boards, and the downward cross-sectional area of ​​the legs gradually decreases. The high heat insulation page-turning PCB module provided by the application is very convenient for maintenance; secondly, the stacked PCB boards are separated by feet, and the cross-sectional area of ​​the feet downwards gradually decreases, under the premise of ensuring the support strength The contact area of ​​the heat conduction surface is greatly reduced, the heat conduction speed is reduced, and the heat insulation effect is enhanced.

Description

【Technical field】 [0001] The present application relates to the technical field of PCB, in particular to a high heat insulation page-turning PCB module. 【Background technique】 [0002] With the development of technology, people have given more and more functions to PCB boards. As the design of PCB boards becomes more and more complex, in order to standardize the design, a modular layout of one or more PCB boards has appeared. There are a lot of PCB boards in the equipment. If it is installed in layers, it will be difficult to maintain later and the heat insulation effect between adjacent PCB boards is poor. If it is installed in tiles, it will take up a lot of space. 【Content of invention】 [0003] The purpose of this application is to provide a high heat insulation page-turning PCB module. In the high heat insulation page-turning PCB module proposed by the embodiment of this application, the PCB board can slide between the two sides of the arched guide rod. Multiple PCB ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K5/02H05K7/20
CPCH05K1/144H05K5/0213H05K7/20136H05K2201/042H05K2201/062
Inventor 姚丽俊成国梁
Owner 深圳市江霖电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products