Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Liquid cooling device and electronic equipment

A liquid cooling and liquid cooling tube technology, applied in the field of liquid cooling devices and electronic equipment, can solve the problems of restricting the improvement of the heat dissipation effect of the liquid cooling tube, and achieve the effects of improved heat dissipation effect, improved heat dissipation effect and good fluidity.

Active Publication Date: 2020-05-22
维沃移动通信(重庆)有限公司
View PDF19 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention discloses a liquid cooling device and electronic equipment to solve the problem that the current liquid cooling tube restricts the improvement of the heat dissipation effect of the liquid cooling tube due to the contradiction between the fluidity of the cooling medium itself and the filling amount of the cooling medium.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Liquid cooling device and electronic equipment
  • Liquid cooling device and electronic equipment
  • Liquid cooling device and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] Please refer to Figure 1-Figure 6 As shown, the embodiment of the present invention discloses a liquid cooling device, and the disclosed liquid cooling device includes a cooling medium,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a liquid cooling device and electronic equipment. The liquid cooling device comprises a cooling medium, a liquid cooling pipe, a driving mechanism and a stirring mechanism; thecooling medium is arranged in the pipe cavity of the liquid cooling pipe; the liquid cooling pipe is provided with a guide through hole, and the guide through hole is communicated with a pipe cavityof the liquid cooling pipe; the stirring mechanism comprises a stirring rod; and the stirring rod is provided with a first end and a second end, the first end of the stirring rod is located in a pipecavity of the liquid cooling pipe, the second end of the stirring rod penetrates through the guide through hole and is connected with the driving mechanism, and the driving mechanism drives the stirring rod to move relative to the pipe cavity of the liquid cooling pipe. According to the scheme, the problem that the improvement of the heat dissipation effect of an existing liquid cooling pipe is restricted due to the contradiction between the liquidity of a cooling medium and the filling amount of the cooling medium can be solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a liquid cooling device and electronic equipment. Background technique [0002] With the rapid development of mobile phone performance, it is no longer limited to simple communication functions, but also has other application functions such as work and entertainment to meet people's work and entertainment needs; Over time, some large-scale applications are prone to mobile phone heating, especially in the process of running mobile games, the high-load operation of the mobile phone chip causes serious heating of the mobile phone chip itself, which not only affects the operating ability of the chip itself, but also causes the running program to freeze. In addition, the overheating of the mobile phone will cause the mobile phone to automatically shut down, which will seriously affect the user experience. [0003] In order to solve the heat dissipatio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272
Inventor 郑小骏
Owner 维沃移动通信(重庆)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com