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Packaging structure and preparation method thereof, and display panel

A packaging structure and buffer unit technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of slow expansion of failure area and unusable panels, so as to prevent the expansion of failure area and improve packaging effect Effect

Active Publication Date: 2020-05-19
GUANGDONG JUHUA PRINTING DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the commonly used TFE structure is a laminated structure of water-oxygen barrier layer / organic buffer layer / water-oxygen barrier layer, but it still has certain defects. When there is a water-oxygen permeation channel on TFE, water and oxygen will pass through this channel slowly. Diffusion around this area will slowly expand the invalid area, eventually making the panel unusable

Method used

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  • Packaging structure and preparation method thereof, and display panel
  • Packaging structure and preparation method thereof, and display panel
  • Packaging structure and preparation method thereof, and display panel

Examples

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Embodiment Construction

[0020] In order to facilitate the understanding of the present invention, the following will describe the present invention more fully and give preferred embodiments of the present invention. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0022] Such as figure 1 As sh...

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Abstract

The invention relates to a packaging structure and a preparation method thereof, and a display panel. The packaging structure is used for packaging a light-emitting device, the light-emitting device comprises a pixel area used for arranging a light-emitting unit and a non-pixel area surrounding the pixel area, and the packaging structure comprises a first inorganic barrier layer, a buffer layer and a second inorganic barrier layer which are arranged in a stacked manner; the buffer layer comprises a plurality of organic buffer units, and each organic buffer unit is arranged in the pixel area and is independently arranged corresponding to one light-emitting unit. According to the display packaging structure, each sub-pixel can be provided with an independent buffer structure, water, oxygen and the like can be prevented from diffusing to the adjacent sub-pixels, a failure area is further prevented from being enlarged, and the packaging effect and the long-term use stability of the panel are improved.

Description

technical field [0001] The invention relates to the technical field of electronic display, in particular to a packaging structure, a preparation method thereof, and a display panel. Background technique [0002] In the contemporary information society, the importance of the display as a visual information transmission medium is further strengthened. In order to occupy a dominant position in the future, the display is moving towards lighter, thinner, lower power consumption, lower cost and better image quality. trend development. [0003] Organic light-emitting diodes (OLEDs) have the advantages of self-luminescence, fast response, wide viewing angle, high brightness, and thinness; These advantages have become the two main directions for the development of the display field at present. [0004] At present, whether it is OLED or QLED, its service life has always been the focus of the industry. OLED and QLED materials are sensitive to water and oxygen, so strict packaging is...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/12H10K50/846H10K50/844H10K71/00
Inventor 史文陈亚文
Owner GUANGDONG JUHUA PRINTING DISPLAY TECH CO LTD
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