Substrate drying method and substrate drying device

Abstract

The invention comprises: supplying a processing solution containing a sublimable substance onto the surface of a substrate whereon a liquid has been adhered, thereby forming a liquid film, and causingthe liquid film to solidify, to yield a solidified body; and supplying a nitrogen gas to the solidified body formed on the surface of the substrate, in such a manner that the flow rate per unit surface area is constant for the entirety of the substrate surface. In the invention, the solidified body sublimates uniformly over the entirety of the substrate surface, and the gas-solid interface on thesolidified body moves in an orthogonal direction relative to the substrate surface. In this manner, protruding portions from a pattern are not subjected to a pull by the movement of the gas-solid interface on the solidified body, thereby preventing a collapse of the pattern formed on the substrate surface, while allowing the surface to be dried suitably.

Description

technical field [0001] The present invention relates to a substrate drying method and a substrate drying apparatus for drying the substrate by removing liquid adhering to the front surface of thin plate-shaped precision electronic substrates such as semiconductor wafers (hereinafter simply referred to as "substrates"). Background technique [0002] In the manufacturing process of electronic components such as semiconductor devices, various liquid treatments such as cleaning treatment with chemical liquid and rinsing treatment with pure water (DIW: deionized water) are performed on the substrate. After the liquid treatment is completed, a drying treatment for removing the liquid remaining on the substrate is required. Typically, for example, a spin drying process is performed in which the substrate is dried by rotating the substrate at a high speed to shake off the liquid adhering to the substrate by centrifugal force. [0003] However, when the liquid adhering to the substr...

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Problems solved by technology

[0003] However, when the liquid adhering to the substrate is removed by a conventional general drying process, the collapse of the pattern formed on the front surface of the substrate becomes a problem.

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