Method for constructing forward current gain degradation model of bipolar transistor in radiation environment

A bipolar transistor, forward current technology, applied in the direction of transistor, design optimization/simulation, etc., can solve the problems of bipolar transistor forward current gain degradation, large injection effect, transistor current degradation, etc., to achieve wide applicability , few fitting parameters, accurate prediction effect

Active Publication Date: 2020-04-21
EAST CHINA NORMAL UNIV +1
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Problems solved by technology

In addition, when the transistor works in the forward active mode, the higher BE junction bias will make the concentration of minority carriers injected from the emitter region into the base region may approach or even exceed the majority carrier concentration of the base region, that is, Large injection effect degrades transistor current gain
The classic Messenger Spratt model ignores the influence of large injection effects, and there are limitations in characterizing the degradation of forward current gain of bipolar transistors under high bias voltage

Method used

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  • Method for constructing forward current gain degradation model of bipolar transistor in radiation environment
  • Method for constructing forward current gain degradation model of bipolar transistor in radiation environment
  • Method for constructing forward current gain degradation model of bipolar transistor in radiation environment

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Embodiment Construction

[0023] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0024] refer to figure 1 , the radiation environment, especially the heavy ion radiation, will cause a decrease in the minority carrier lifetime, leading to an annealing of the current gain of the bipolar transistor. from figure 1 As shown in the "symbol" in the figure, it can be seen that the damage factor (DF) of bipolar transistor forward current gain degradation gradually decreases with low bias voltage, and the high bias part increases with bias voltage. The degradation of the forward current gain of the transistor fitted by the conventional degradation model that does not consider the large injection effect is as follows: figure 1 As shown in the "line" in the middle, it can be seen that the conventional model can reproduce the variation of DF in the low bias part very well, but there is a large deviation in the high bias part.

[0025] Aimin...

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Abstract

The invention discloses a method for constructing a forward current gain degradation model of a bipolar transistor in a radiation environment. The method comprises the following steps of: a) obtainingthe concentration nE of minority carriers injected into a base region from an emitter region based on emitter current under a large injection condition; b) obtaining distribution of base current andcurrent gain; c) establishing a radiation environment forward current gain degradation model; and d) model verification. According to the model constructed by the invention, the influence of a large injection effect is mainly considered, so that the degradation of the forward current gain of the bipolar transistor can be accurately calculated, and the degradation of a forward current gain damage factor in a full bias range is obtained; few fitting parameters are needed, the applicability is wide, and the model provides more accurate prediction for the reliability of the bipolar transistor in the radiation environment.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a method for constructing a bipolar transistor forward current gain degradation model in a radiation environment. Background technique [0002] With the continuous extension of space exploration, more and more electronic systems will be applied in various radiation environments. Space radiation effects can cause varying degrees of damage to electronic devices, leading to system failures. Bipolar transistors have strong radiation resistance and have shown great application prospects in space radiation environments in recent years. Space radiation, especially neutron radiation and heavy ion radiation, produces a large amount of displacement damage inside semiconductor materials and devices, which increases the probability of carrier scattering and reduces the lifetime of carriers. As a minority carrier device, the reduction of the minority carrier lifetime in t...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/20H01L29/73
CPCH01L29/73
Inventor 孙亚宾王昌锋田明李小进石艳玲廖端泉曹永峰
Owner EAST CHINA NORMAL UNIV
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