Grinding device and surface grinder using same

Abstract

The invention relates to the technical field of grinding machines, in particular to a grinding device and a surface grinding machine using the grinding device. The grinding device includes: a grinding plate, which cooperates with a guide structure on the surface grinding machine to perform horizontal reciprocating motion. The grinding plate has The grinding plane is in contact with the surface of the workpiece to grind the surface of the workpiece; the connecting rod is hinged with the grinding plate; the driving rod is connected with the connecting rod at one end and the horizontal spindle of the surface grinder at the other end. Beneficial effects: the horizontal spindle drives the drive rod to rotate, and then drives the connecting rod to move, and then the connecting rod moves with the grinding plate. Since the grinding plate cooperates with the guide structure on the surface grinder, the grinding plate can only do horizontal reciprocating motion. In this way, the grinding plate can use the grinding plane to grind the surface of the workpiece, and the grinding plate and the workpiece are in surface-to-face contact, and the contact area increases, so that the local force on the workpiece can be reduced and local thermal stress can be avoided. Relatively large, thereby avoiding the problem of workpiece deformation.

Description

technical field [0001] The invention relates to the technical field of grinding machines, in particular to a grinding device and a surface grinding machine using the grinding device. Background technique [0002] Plate grinding is usually carried out on a surface grinder. During grinding, the electromagnetic workbench uses magnetic force to absorb the plate or clamp and fix the plate on the workbench. The horizontal spindle drives the grinding wheel to rotate at high speed to grind the surface of the plate. During the grinding process, the contact between the grinding wheel and the plate is a line contact, and the plate is locally stressed, which causes the local thermal stress of the plate to be relatively large, and the plate deforms seriously after the magnetic force is released, especially for workpieces that cannot be absorbed by magnetic force. There is no tight adsorption force between the worktables, and the workpiece is more easily deformed. Contents of the invent...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a grinding device to solve the problem of relatively large local thermal stress and easy deformation of the workpiece caused by grinding the surface of the workpiece by the rotation of the grinding wheel in the prior art; the purpose of the present invention is also to provide a A surface grinder, in order to solve the problems in the prior art that the surface of the workpiece is ground by the rotation of the grinding wheel, which causes relatively large local thermal stress and easy deformation of the workpiece

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