Drilling control method for multi-layer board

A control method and technology for multi-layer boards, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of prone to errors, wrong drilling procedures, batch scrapping, etc., to reduce labor intensity and eliminate quality. effect of risk

Active Publication Date: 2021-02-19
南通深南电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a drilling control method for multi-layer boards, which aims to solve the problem that in the prior art, after the multi-layer board package enters the drilling process, it is necessary to manually call the drilling program, which is prone to mistakes and exists The phenomenon of using the wrong drilling program, resulting in the problem of batch scrapping

Method used

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  • Drilling control method for multi-layer board
  • Drilling control method for multi-layer board
  • Drilling control method for multi-layer board

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, the ...

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Abstract

The present invention provides a drilling control method for multi-layer boards. The method for controlling drilling of multi-layer boards includes: obtaining the second code corresponding to the multi-layer board package, wherein the pin insertion machine fixes the multi-layer The circuit board forms the multi-layer board package; the inkjet equipment is controlled to spray the second code on the multi-layer board package; after the scanner connected to the drilling machine scans to obtain the second code, all the scanned codes are scanned The drilling program corresponding to the second code is sent to the drilling machine for the drilling machine to perform drilling operations according to the drilling program. The drilling control method for multi-layer boards provided by the present invention enables the system to automatically send processing parameters to equipment, effectively eliminates quality risks caused by manual misoperations, and reduces manual labor intensity.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a drilling control method for multilayer boards. Background technique [0002] The printed circuit board is the carrier of the control circuit on the electronic equipment and is an important electrical device on the electronic equipment. When mass-producing printed circuit boards, it is often necessary to drill holes for multi-layer boards at the same time. Before drilling, each board is fixed with a pin insertion machine. In the prior art, the pin insertion machine is a manual machine. , The stacking of printed circuit boards is manually operated. The bottom of the stack needs to be padded with cardboard, and the top needs to be covered with aluminum sheets. The phenomenon of using the wrong drilling program will cause batch scrapping. Contents of the invention [0003] The main purpose of the present invention is to provide a drilling control method for multi-layer b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 闵秀红邹长青
Owner 南通深南电路有限公司
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