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Seed potato grading and slicing device for potato

A potato, dicing technology, applied in the direction of rhizome seed cutting machine, solid separation, seed and rhizome processing, etc., can solve the problems of increased production cost, waste of seeds, insufficient differentiation of seed potatoes, etc., and achieves the effect of avoiding damage

Pending Publication Date: 2020-04-10
CHONGQING ACAD OF AGRI SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Potatoes are vegetatively propagated plants with tubers. There is more than one bud eye on a potato, and generally there are multiple bud eyes. The waste of a large number of seeds increases the production cost. Therefore, the potatoes must be cut into pieces according to the bud eyes every year before sowing. The traditional potato seed cutting is to manually cut the whole potato into several seed blocks with bud eyes. The efficiency of manual cutting Low, labor-intensive, and labor-intensive, which is not conducive to large-scale mechanical planting; it cannot be strictly sterilized, and it is easy to be infected with viruses;
[0003] In the prior art, the cutting of seed potatoes also partially adopts mechanical cutting methods, but due to the different sizes of potatoes, the existing devices cannot perform multi-level screening on seed potatoes, and the distinction of seed potatoes is not thorough enough. The seed potatoes are easily damaged when the blocks are clamped and transported

Method used

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  • Seed potato grading and slicing device for potato
  • Seed potato grading and slicing device for potato
  • Seed potato grading and slicing device for potato

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0065] Such as Figure 1 to Figure 3 As shown, in this example, a seed potato grading and dicing device is illustrated, including a feeding mechanism 100 for feeding seed potatoes, and a screening mechanism 200 connected to the feeding mechanism 100, which is used for seed potatoes of different sizes. Screening and grading, the seed potatoes are separated into different grades according to the size, and then sent to the subsequent cutting process;

[0066] Clamping and cutting unit, one or more clamping and cutting units, corresponding to the classification of seed potatoes. The unit is connected downstream of the screening mechanism 200, and is used for clamping and cutting the classified seed potatoes;

[0067] Wherein, the clamping and cutting unit includes a seeding mechanism 300 and a flexible clamping and cutting mechanism 400, the seeding mechanism 300 is connected below the screening mechanism 200, and is used to send the graded seed potatoes individually into the fle...

other Embodiment approach

[0104] In other embodiments, multiple clamping and cutting units can be set according to the number of classifications to form multi-way cutting and seed dressing.

[0105] The seed potatoes of the present invention can be screened and separated into grades of different sizes by the screening mechanism, which can be pre-selected for the selection of the cutting method or the quality division; each grade corresponds to a clamping and cutting unit, and the seed potatoes are processed by the flexible clamping and conveying components. Clamping and transmission can adapt to the size of the seed potato to avoid damage to the seed potato. The cutting unit is equipped with half and horizontal and vertical cutting methods, which can be cut in different forms according to the size or weight of the potato pieces, which can make more reasonable and effective use of seed potatoes, and the disinfection nozzles set on both sides of the cutting knife can clean the knife And seed potato incis...

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PUM

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Abstract

The invention provides a seed potato grading and slicing device for a potato. The device comprises a material feeding mechanism, a sieving mechanism and one or a plurality of clamping and slicing units, wherein the material feeding mechanism is used for loading materials of the seed potatoes; the sieving mechanism is used for sieving and grading the seed potatoes of different sizes, and is connected with the material feeding mechanism; each clamping and slicing unit is connected to a downstream position of the sieving mechanism, is used for clamping and slicing the graded seed potatoes, and comprises a seed arrangement mechanism and a flexible clamping and cutting mechanism, wherein the seed arrangement mechanism is used for sending single graded seed potato into the flexible clamping andcutting mechanism; the flexible clamping and cutting mechanism comprises a flexible clamping and conveying component and a cutting component, wherein the flexible clamping and conveying component is used for tightly clamping the seed potatoes and conveying the clamped seed potatoes to the cutting component; and the seed potatoes are sliced through the cutting component. By use of the seed potato grading and slicing device disclosed by the invention, the seed potatoes are sieved and separated through the sieving mechanism into grades of different sizes, each grade corresponds to one clamping and slicing unit, and the seed potatoes are clamped and transmitted through the flexible clamping and conveying component. The seed potato grading and slicing device can be adaptive to the size of eachseed potato so as to prevent the seed potato from being damaged.

Description

technical field [0001] The invention belongs to the field of agricultural machinery, and in particular relates to a seed potato grading and dicing device. Background technique [0002] Potatoes are vegetatively propagated plants with tubers. There is more than one bud eye on a potato, and generally there are multiple bud eyes. The waste of a large number of seeds increases the production cost. Therefore, the potatoes must be cut into pieces according to the bud eyes every year before sowing. The traditional potato seed cutting is to manually cut the whole potato into several seed blocks with bud eyes. The efficiency of manual cutting Low, labor-intensive and labor-intensive, which is not conducive to large-scale mechanical planting; strict disinfection is not possible, and it is easy to be infected with viruses; [0003] In the prior art, mechanical cutting is also used in part for cutting seed potatoes. However, due to the different sizes of potatoes, the existing devices ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A01C1/00B07B1/14B07B1/42B07B1/46
CPCA01C1/00A01C1/005B07B1/14B07B1/42B07B1/46
Inventor 张涛梁涛李英崔晋波庞有伦张先锋张莹李平代治国唐兴隆
Owner CHONGQING ACAD OF AGRI SCI
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