Stacked chip, manufacturing method and electronic device
A stacked chip technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of wasting wafer area and increasing the manufacturing cost of stacked chips, and achieve the goal of improving yield rate, reducing cost and improving performance Effect
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[0109] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.
[0110] It should be understood that the specific examples herein are only intended to help those skilled in the art better understand the embodiments of the present application, rather than limit the scope of the embodiments of the present application.
[0111] It should also be understood that in various embodiments of the present application, the sequence numbers of the processes do not mean the order of execution, and the execution order of the processes should be determined by their functions and internal logic, and should not be used in the embodiments of the present application. The implementation process constitutes any limitation.
[0112] It should also be understood that the various implementation manners described in this specification can be implemented alone or in combination, which is not limited in the embodiments of...
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