Protection device applied to thermoelectric double field

Abstract

The invention provides a protective device applied to a thermoelectric double field, which comprises a workpiece area, a first coating, a second coating and a heat-conducting and electric-conducting substrate from inside to outside, the sizes of the first coating and the second coating are determined by physical parameters of a material and the geometric size of the workpiece area, and the physical parameters comprise the heat conductivity and the electric conductivity of the material. According to the method, accurate solutions of temperature field and direct-current electric field protectionconditions can be obtained at the same time, and the original distribution states of the temperature field and the direct-current electric field in the matrix are not disturbed. The protection devicedesigned by applying the method is effective for a single temperature field or a direct-current electric field, and also has a protection function when the temperature field and the direct-current electric field act at the same time.

Description

technical field [0001] The invention relates to a protection device, in particular to a protection device applied to thermoelectric double fields. Background technique [0002] When the electronic device works in the circuit, because the conductivity of the electronic device is different from that of a uniform conductive substrate such as a circuit board, current concentration or divergence occurs. This phenomenon causes different Joule heat to be generated in different areas of the circuit board, and these heats are easy to burn the electronics. Devices; machine parts working in extreme temperature (high or low temperature) environments need to be connected or in close contact with the surrounding heat-conducting matrix, but their thermal conductivity is different from that of the surrounding heat-conducting matrix, resulting in local heat flow concentration or divergence, which will cause abnormal Uniform thermal stress affects the mechanical strength and fatigue life of m...

AI Technical Summary

Problems solved by technology

[0002] When the electronic device works in the circuit, because the conductivity of the electronic device is different from that of a uniform conductive substrate such as a circuit board, current concentration or divergence occurs. This phenomenon causes different Joule heat to be generated in different areas of the circuit board, and these heats are easy to burn the electronics. Devices; machine parts working in extreme temperature (high or low temperature) environments need to be connected or in close contact with the surrounding heat-conducting matrix, but their thermal conductivity is different from that of the surrounding heat-conducting matrix, resulting in local heat flow concentration or divergence, which will cause abnormal Uniform thermal stress, affecting the mechanical strength and fatigue life of machine parts

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