Novel active organic electroluminescence diode packaging structure capable of preventing extrusion

A packaging structure and diode technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of inconvenient portability, poor sealing performance, and reduced service life, so as to facilitate storage and management, prolong service life, and reduce maintenance costs Effect

Inactive Publication Date: 2020-03-27
深圳市宏迪尼斯技术有限公司
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  • Abstract
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Problems solved by technology

[0004] The purpose of the present invention is to provide a new type of active organic electroluminescent diode packaging structure that prevents extrusion, so as to solve the diode packaging structure currently on the market proposed by the above-mentioned background technology, causing diodes to collide with each other, and the sealing performance is poor, which reduces the service life , inconvenient to carry, inconvenient to check, inconvenient to dissipate heat

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  • Novel active organic electroluminescence diode packaging structure capable of preventing extrusion
  • Novel active organic electroluminescence diode packaging structure capable of preventing extrusion
  • Novel active organic electroluminescence diode packaging structure capable of preventing extrusion

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] see Figure 1-4 , the present invention provides a technical solution: a novel active organic electroluminescent diode packaging structure that prevents extrusion, including a packaging box 1, a diode placement cavity 2, a positive lead slot 3, a lead bend 4, and a negative lead slot 5 , external positive lead groove 6, external negative lead groove 7, flexible board 8, heat sink 9, groove 10, spring 11, buckle block 12, box cover 13, first sealing slee...

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Abstract

The invention discloses a novel active organic electroluminescence diode packaging structure capable of preventing extrusion. The packaging structure comprises a packaging box, a box cover, a first sealing sleeve, a ball groove, a fixing block and a buckle groove. A diode placing cavity is formed in the packaging box, a positive electrode lead groove is formed in the diode placement cavity and isfixedly connected with a lead bent pipe, and a heat dissipation device is fixedly connected below the diode placement cavity. A groove is formed in the packaging box, a spring is fixedly connected into the groove, and a buckling block is fixedly connected to the other end of the spring. A first sealing sleeve is fixedly connected to the left side face of the box cover, a fixing block is fixedly connected to the box cover, and a buckling groove is formed in the fixing block. The novel active organic electroluminescence diode packaging structure capable of preventing extrusion is provided with the box cover, the first sealing sleeve, the second sealing sleeve, a connecting rod, the ball and the ball groove, so that a light-emitting diode in the diode placing cavity can be effectively prevented from being extruded.

Description

technical field [0001] The invention relates to the technical field of light-emitting diode packaging structures, in particular to a novel active organic electroluminescent diode packaging structure that prevents extrusion. Background technique [0002] A diode is a semiconductor device that converts AC power into DC power. Usually it consists of a PN junction with two terminals, positive and negative. The most important characteristic of a diode is unidirectional conductivity. In the circuit, current can only flow in from the positive terminal of the diode and flow out from the negative terminal. Rectifier light-emitting diodes generally require relatively high performance, and precious metals are added as conductors in rectifier light-emitting diodes, so the price is relatively expensive. The packaging of existing rectifier light-emitting diodes is basically the same as that of ordinary diodes, and they are all packaged in ordinary plastic bags. However, the sensitivity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L25/10
CPCH01L25/10H10K50/805H10K50/841H10K50/87H10K50/84
Inventor 王慧芳
Owner 深圳市宏迪尼斯技术有限公司
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