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Sensors for Simultaneous Measurement of Bending Strain and Pressure

A bending strain and sensor technology, applied in the direction of measuring force, measuring device, electromagnetic measuring device, etc., can solve problems such as difficult alignment in the production process, complex sensor structure, waste of materials, etc., and achieve the effect of cost saving

Active Publication Date: 2021-07-16
BEIJING INST OF NANOENERGY & NANOSYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) The layered structure leads to a complex structure of the sensor, which is difficult to align during the production process;
[0005] (2) Using complex manufacturing processes such as photolithography and vacuum deposition, resulting in waste of materials;
[0006] (3) Difficult to commercialize

Method used

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  • Sensors for Simultaneous Measurement of Bending Strain and Pressure
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  • Sensors for Simultaneous Measurement of Bending Strain and Pressure

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Embodiment Construction

[0042] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Apparently, the described embodiment is one embodiment of the present invention, but not all of them. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0043] Unless otherwise defined, the technical terms or scientific terms used in the present invention shall have the usual meanings understood by those skilled in the art to which the present invention belongs.

[0044] Some embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. In the case of no conflict, t...

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Abstract

The invention discloses a sensor for simultaneously measuring bending strain and pressure. The sensor comprises a first support layer, a metal thin film layer, a dielectric layer, a second support layer and an electrode layer which are sequentially arranged from bottom to top; The metal thin film layer is embedded between the first supporting layer and the dielectric layer for inducing bending strain, and the electrode layer is arranged parallel to the metal thin film layer for forming a capacitor with the metal thin film layer pressure sensor. The sensor according to the invention can simultaneously detect pressure and bending strain, and its manufacturing process is non-toxic and does not require a mask, thereby saving costs.

Description

technical field [0001] The invention relates to the field of pressure and bending strain measurement, in particular to a sensor for measuring bending strain and pressure. Background technique [0002] With the rapid development of the field of human-computer interaction, electronic skin has received great attention. Electronic skin detects temperature, strain, humidity and pressure by simulating human skin and converting external stimuli into electrical signals, and because electronic skin needs to realize the function of single-point parallel multi-function detection, that is, it can detect multiple stimuli at the same time. Sensors that detect stimuli. [0003] In the prior art, there are following disadvantages regarding the manufacturing method of this type of sensor: [0004] (1) The layered structure leads to a complex structure of the sensor, which is difficult to align during the production process; [0005] (2) Using complex manufacturing processes such as photol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01D21/02
CPCG01B7/22G01L1/142
Inventor 潘曹峰鲍容容付胜
Owner BEIJING INST OF NANOENERGY & NANOSYST
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