Die bonder with glue brushing device and working method thereof

A technology of solid crystal machine and glue brushing, which is applied in the direction of electrical solid devices, semiconductor/solid device manufacturing, electrical components, etc., and can solve problems such as inconvenient operation by staff, inconvenient substrate fixing, substrate movement, etc.

Inactive Publication Date: 2020-03-24
马鞍山三投光电科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Die bonders are used to realize the electrical connection between semiconductor devices and substrates. However, the existing die bonders are generally inconvenient to control the dripping of glue on the substrate. At the same

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Die bonder with glue brushing device and working method thereof
  • Die bonder with glue brushing device and working method thereof
  • Die bonder with glue brushing device and working method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0043] see Figure 1-10 , in an embodiment of the present invention, a crystal bonder with a glue brushing device includes a body 1, a glue box 2 and a loading plate 3;

[0044] The plastic box 2 is fixedly connected to the top of the machine body 1, the top of the plastic box 2 is fixedly connected with a fixed plate 4, the movable plate 5 is movably connected between the fixed plate 4 and the plastic box 2, and the fixed plate 4 is fixedly connected with a d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a die bonder with a glue brushing device and a working method thereof. The die bonder comprises a machine body, a glue containing box and an object carrying plate. The glue containing box is fixedly connected to the upper portion of the machine body, a fixed plate is fixedly connected to the upper portion of the glue containing box, a movable plate is movably connected between the fixed plate and the glue containing box, and a telescopic device used for driving the movable plate is fixedly connected to the fixed plate. A glue outlet rod movably penetrates through the glue containing box; a glue outlet hole is upwards formed in the bottom end of the glue outlet rod; a glue inlet hole communicated with the glue outlet hole is formed in the glue outlet rod in the gluecontaining box; a threaded rod is fixedly connected to the top of the glue outlet rod located above the glue containing box, the upper end of the threaded rod sequentially penetrates through the movable plate and the fixed plate and extends to the position above the fixed plate, a nut is in threaded connection with the threaded rod, the position of a base plate can be adjusted conveniently, and meanwhile glue can be applied to the base plate conveniently.

Description

technical field [0001] The invention relates to a crystal bonder, in particular to a crystal bonder with a glue brushing device and a working method thereof. Background technique [0002] Die bonding machine is the equipment used in the chip loading process in the semiconductor chip packaging process. When working, the tape conveyor clip of the die bonder drives the frame carrying the chip to be transported on the track plane, so that each chip passes through the dispensing position and the loading position in turn for corresponding dispensing and welding operations. [0003] Die bonders are used to realize the electrical connection between semiconductor devices and substrates. However, the existing die bonders are generally inconvenient to control glue dripping on the substrate, so it is inconvenient for the staff to operate, and at the same time, it causes waste of glue. At the same time, it is inconvenient to fix the substrate in the crystal machine. Generally, the subst...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67H01L21/60
CPCH01L21/67144H01L21/6715H01L24/83H01L2224/83986
Inventor 张文具刘晓旭
Owner 马鞍山三投光电科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap