A reworkable one-component epoxy structural adhesive and its preparation method and application

An epoxy structural adhesive, one-component technology, applied in the field of electronic adhesives, can solve the problem of difficult repair of one-component epoxy structural adhesives, and achieve the effects of reduced bond strength, high bond strength, and long operating time.

Active Publication Date: 2022-07-12
南京金世家新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Purpose of the invention: the present invention aims at the problem that the existing one-component epoxy structural adhesive is difficult to repair. The present invention provides a single-component epoxy structural adhesive that can be repaired. The single-component epoxy structural adhesive has the following characteristics: ( 1) High adhesion; (2) Good toughness; (3) Fast curing at low temperature (can meet the curing conditions of 10min@80°C); (4) Long operating time

Method used

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  • A reworkable one-component epoxy structural adhesive and its preparation method and application
  • A reworkable one-component epoxy structural adhesive and its preparation method and application
  • A reworkable one-component epoxy structural adhesive and its preparation method and application

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preparation example Construction

[0033] The preparation method of the epoxy structural adhesive of embodiment 1~6

[0034] Add bisphenol A or F epoxy resin, polyurethane modified epoxy resin, polythiol curing agent, heat stabilizer, thixotropic agent and black pigment to the double planetary mixer (Taiyi (Shanghai) Industrial Co., Ltd. Co., Ltd., model TSJ-5), the circulating condensed water in the jacket of the kettle wall is opened first, and then the mechanical stirring and the high-speed dispersing plate are opened. By adjusting the temperature and flow rate of the condensed water, the temperature of the material in the kettle is controlled not to exceed 30 °C (the temperature and flow rate of the cooling water are adjusted according to the actual temperature in the kettle. Speed ​​up the heat dissipation to ensure that the temperature of the material in the kettle does not exceed 30 °C); after mixing evenly, add the accelerator, continue to stir and disperse, and still control the temperature not to exce...

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Abstract

The invention discloses a reworkable one-component epoxy structural adhesive and a preparation method and application thereof. The structural adhesive is mainly made of the following raw materials by weight: 15.0-35.0 percent of bisphenol A or F epoxy resin, Polyurethane modified epoxy resin 15.0-35.0%, polythiol curing agent 25.0-35.0%, accelerator 2.0-4.0%, stabilizer 1.0-2.0%, thixotropic agent 4.0-6.0%, black pigment 1.0-3.0 %. The structural adhesive of the present invention is mainly applied to the bonding of micro-devices in small electronic products such as mobile phones, tablets, notebook computers and automotive display screens, and has the following characteristics: (1) repairable; (2) high bonding force; (3) ) Good toughness; (5) Fast curing at low temperature (can meet the curing conditions of 10min@80℃); (4) Long operating time. At the same time, the invention has simple production process and high efficiency, and can be applied in large-scale production.

Description

technical field [0001] The invention relates to the field of electronic adhesives, in particular to a reworkable single-component epoxy structural adhesive for bonding micro-devices in small electronic products such as mobile phones, tablets, notebook computers and automotive display screens, and a preparation method and application thereof . [0002] technical background [0003] At present, as mobile electronic products and automotive electronic products gradually enter the life of the public, the demand for structural adhesives for bonding micro electronic devices is increasing. Compared with the two-component adhesive, the one-component structural adhesive is more evenly mixed with its internal components and has a better consistency. bond. In addition, these electronic products are required to be lighter and thinner, so plastic or composite materials are used to replace metals on many devices, resulting in many devices not resistant to high temperature for a long time,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C08G59/66
CPCC09J163/00C09J11/08C08G59/66C08L2205/035C08L2205/025C08L2203/20C08L63/00C08L75/04
Inventor 杜尚霏刘伟
Owner 南京金世家新材料科技有限公司
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