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Material taking device in electroplating process of SMD resistor

A technology of electroplating process and chip resistors, which is applied in the direction of electrolysis process and electrolysis components, can solve the problems that cannot meet the high-efficiency production needs of factories, and achieve the effects of preventing scattering, thorough material removal, and convenient use

Pending Publication Date: 2020-02-28
湖南旺诠电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, after the electrolysis is completed, the resistor and the ball need to be separated. Most of the existing operations are manual, which cannot meet the high-efficiency production needs of the factory. This problem needs to be solved urgently.

Method used

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  • Material taking device in electroplating process of SMD resistor
  • Material taking device in electroplating process of SMD resistor
  • Material taking device in electroplating process of SMD resistor

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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present invention. .

[0029] like Figure 1-8 Shown, the specific structure of the present invention is: a kind of pick-up device in the patch resistance electroplating process, and it comprises pick-up device, body, feeding device; Frame 3, described drum 1 comprises the cylindrical outer tube 11 of loose fit, inner tube 12, and it is made of plastic material, and described outer tube 11 can rotate around the horizontal axis and erect on the drum bracket 2, and drum bracket 2 can The drum 1 is inserted and taken out from the electrolyte, and the two ends of the outer cylinder 11 are coaxially provided with an outer cylind...

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PUM

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Abstract

The invention discloses a material taking device in the electroplating process of an SMD resistor. The material taking device comprises a roller, a roller support and a material taking support. The roller comprises an outer roller body and an inner roller body, the outer roller body is erected on the roller support, and outer roller gears are arranged at the two ends of the outer roller body. A cover plate is arranged on the outer roller body, a material opening is formed in the inner roller body, and he cover plate cooperates with the material opening through a rapid locking mechanism. Liquidpassing holes and an air outlet hole facing the material opening are formed in the wall of the inner roller body. During material taking, the air outlet hole communicates with a pressure gas source through a pipeline. A first motor is arranged on the material taking support, and a first gear is arranged at the output end of the first motor. A screening plate is arranged below the material takingrack, a material taking guide rail is arranged at the bottom of the material taking rack, a vibration motor is arranged on the screening plate, and a first drive mechanism enabling the material takingrack to move is arranged on the material taking guide rail. The material taking rack is provided with a grabbing mechanism detachably connected with the cover plate. According to the aims of the material taking device, after the roller is turned over, air is blown for material taking, material taking is achieved rapidly and thoroughly, meanwhile, balls are separated through a screening mechanism,and labor efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic processing, in particular to a pick-up device in a chip resistance electroplating process. Background technique [0002] Chip resistor (SMD Resistor), also known as chip fixed resistor (Chip Fixed Resistor), is a kind of metal glass glaze resistor. The resistor is made of metal powder and glass glaze powder and printed on the substrate by screen printing method. It is resistant to moisture, high temperature, and small temperature coefficient, which can greatly save the cost of circuit space. The design is more refined, and it is widely used in mainstream electronics. on the circuit board of the product. [0003] SMD resistors are usually composed of several parts: ceramic substrate, back electrode, surface electrode, resistor body, primary glass, secondary glass, terminal electrode, intermediate electrode, and external electrode. The production process is roughly as follows: put ceramic substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/20
CPCC25D17/20
Inventor 孙永光
Owner 湖南旺诠电子科技有限公司
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