Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Forward sound MEMS MIC

A technology of ASIC chip and sound inlet, which is applied in the field of MEMSMIC, can solve the problems of the size limit of the sound cavity of the MEMSMIC, the limitation of the sound pickup performance of the MEMS chip, and the increase of the MEMS chip, so as to improve the sensitivity of the product and the volume of the back sound cavity. The effect of small size and improvement of pickup sensitivity

Pending Publication Date: 2020-02-21
山东新港电子科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the volume of the rear sound cavity depends on the volume of the back cavity of the MEMS chip, and the adjustable range is limited. The size of the MEMS MIC rear sound cavity is very limited. The small volume of the rear sound cavity limits the sound pickup performance of the MEMS chip. As a result, it is difficult to further improve the sensitivity of the current structure of the MEMS MIC. To further improve sensitivity, reduce noise interference, improve sound-to-electricity conversion efficiency, and achieve the purpose of improving the radio effect, a new type of MEMS MIC structure is needed to solve the above problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Forward sound MEMS MIC
  • Forward sound MEMS MIC
  • Forward sound MEMS MIC

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment 1: as attached Figures 1 to 6 As shown, a forward sound MEMS MIC includes a sound chamber housing 1, the sound chamber housing 1 is provided with a sound inlet 3, the sound chamber housing 1 is connected with a PCB2, and the sound chamber housing 1 A sound chamber communicating with the sound inlet hole is formed between the PCB2, a MEMS sound pressure sensor chip 5 and an ASIC chip 6 are arranged in the sound chamber, and a rear sound chamber 51 is provided on the MEMS sound pressure sensor chip 5. The PCB2 is provided with a cavity shell 4, and the cavity shell 4 is installed on the PCB2 through traditional welding, bonding, etc., and the MEMS sound pressure sensor chip 5 is installed on the cavity shell 4, and the cavity shell 4 is provided with a cavity 41 , and a cavity 42 communicating with the cavity 41 is formed between the cavity shell 4 and the PCB 2 , and the cavity 41 communicates with the rear sound cavity 51 on the MEMS sound pressure sensor ch...

Embodiment 2

[0028] Embodiment 2: as attached Figure 7 As shown, in this embodiment, the three side walls of the cavity 42 are formed by the sound cavity shell 1 . Specifically, in this embodiment, the cavity shell 4 has a side wall 43, a top wall with a cavity 41 and two legs 45, and the cavity shell 4 is bonded to the PCB 2 through the side wall 43 and the legs 45. The cavity shell 2 closes the remaining side surfaces between the cavity shell 4 and the PCB 2 , forming a cavity 42 with only one cavity 41 communicating with the outside. This structure can further increase the volume of the rear sound cavity, making the volume of the front sound cavity and the rear sound cavity tend to be the same, and achieve better sound pickup effect. Of course, the side walls on any one side or multiple sides of the cavity 42 can be formed by the sound cavity shell.

[0029] The remaining parts in this embodiment are the same as in Embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a forward sound MEMS MIC. An expanded rear sound cavity communicated with a rear sound cavity is formed by adding a cavity shell to a PCB; the problem that the volume of a traditional rear sound cavity completely depends on the size of an MEMS sound pressure sensor chip is thoroughly solved; the current situation that the rear sound cavity volume is too small and the frontand rear sound cavity volumes are not matched can be effectively improved; the size of the rear sound cavity is increased, so that the amplitude of the MEMS chip is increased, the pickup sensitivityis remarkably improved, the product sensitivity is remarkably improved under the condition that the appearance structure and the overall size are kept unchanged, the product voice is clear, natural and easy to identify, and the product tone quality is improved. The cavity shell is simple in design structure, easy to manufacture and wide in material selection range, different base materials are selected according to different MIC products, the cavity shell and the PCB can be bonded in a glue mode, the process is mature, the yield is high, the different cavity shells can be flexibly matched according to the different MIC products, and the product popularization range is wide.

Description

technical field [0001] The present invention relates to the field of MEMS MIC, in particular to a kind of forward tone MEMS MIC. Background technique [0002] MEMS MIC is a microphone based on MEMS technology, consisting of MEMS sound pressure sensor chip, ASIC chip, front and rear sound chambers and RF suppression circuit. The MEMS sound pressure sensor is a miniature capacitor composed of a silicon diaphragm and a silicon back plate, which can convert the change of sound pressure into a change of capacitance, and then the ASIC chip converts the change of capacitance into an electrical signal to realize "sound-to-electricity" conversion . Among them, the MEMS chip divides the cavity formed by the MEMS shell into a front sound cavity and a rear sound cavity. The rear sound cavity of the forward-sounding MEMS MIC is mainly formed by bonding the MEMS chip and the PCB through glue. In this way, the volume of the rear sound cavity depends on the volume of the back cavity of th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00
Inventor 刘志永朱法超
Owner 山东新港电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com