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Semiconductor packaging and mounting device

A semiconductor and body technology, which is applied in the field of semiconductor packaging and chip mounting devices, can solve the problems of complex semiconductor packaging technology, imperfect semiconductor packaging technology, low efficiency of chip bonding process, etc., and achieves the effect of good controllability of the position of the mechanism

Active Publication Date: 2020-02-11
MICA TECHSUZHOUCO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the semiconductor packaging technology is not perfect, the process of semiconductor packaging technology is too complicated, the packaging forms are also varied, and the chip bonding process is inefficient.

Method used

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  • Semiconductor packaging and mounting device
  • Semiconductor packaging and mounting device
  • Semiconductor packaging and mounting device

Examples

Experimental program
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Effect test

Embodiment

[0017] Example: such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 A semiconductor package chip loading device is shown: including a thimble structure 1 , a blue film fixing structure 2 , a crystal block adsorption structure 3 , a silver paste sprinkling structure 4 , and a body 5 . The blue film fixing structure 2 is installed above the thimble structure 1 , the crystal block adsorption structure 3 is installed on the top of the body 5 , and the silver paste sprinkling structure 4 is installed in front of the thimble structure 1 .

[0018] The elastic thimble 102 of the thimble structure 1 is fixedly installed on the sliding thimble base 103 , and the sliding thimble base 103 is slidably connected with the transverse sliding platform 106 . One end of the pressure spring 101 is in contact with the bottom baffle of the transverse sliding table 106 , and the other end of the pressure spring 101 is in contact with the baffle of the sliding thimble ba...

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Abstract

The invention provides a semiconductor packaging and mounting device. The device comprises a thimble structure, a blue film fixing structure, a crystal block adsorption structure, a silver paste point sprinkling structure and a machine body. The blue film fixing structure is installed above the thimble structure, the crystal block adsorption structure is installed at a top of the machine body, and the silver paste point sprinkling structure is installed in front of the thimble structure. A wafer is obtained through a slicing process to ensure that a wafer block is fixed. A blue film is attached to a bottom, the wafer subjected to the slicing process is placed on a machine body. The blue film is pressed by the blue film fixing structure. A position of the crystal block adsorption structureis controllable, the crystal block adsorption structure moves downwards to adsorb a crystal block at the position with the crystal block, the thimble structure moves upwards to carry out top hit on the crystal block so that the crystal block is separated from the blue film, an adsorption rod transfers the crystal block to a front lead frame, and the silver paste point sprinkling structure dispenses silver paste on a protruding island on the lead frame so that the crystal block is fixed on the lead frame. The plurality of crystal blocks can be transferred and mounted at the same time, the positions of all structures are controllable, and efficiency is high.

Description

technical field [0001] The invention designs a semiconductor packaging technology, in particular to a semiconductor packaging chip loading device. Background technique [0002] At present, the semiconductor packaging technology is not perfect, the process of semiconductor packaging technology is too complicated, the packaging forms are also varied, and the chip bonding process is inefficient. Contents of the invention [0003] In view of the above-mentioned problems, the present invention provides a semiconductor packaging die-loading device, which improves the chip bonding efficiency. [0004] The technical solution used in the present invention is: a semiconductor package chip loading device: including a thimble structure, a blue film fixing structure, a crystal block adsorption structure, a silver paste sprinkling structure, and a body. The blue film fixing structure is installed above the thimble structure, the crystal block adsorption structure is installed on the to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67144
Inventor 冯国栋
Owner MICA TECHSUZHOUCO
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